參數(shù)資料
型號: MC68HLC705KJ1
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Computer Operation Properly Module
中文描述: 電腦操作正確模塊
文件頁數(shù): 97/108頁
文件大小: 718K
代理商: MC68HLC705KJ1
MC68HC705KJ1 MC68HRC705KJ1 MC68HLC705KJ1 Data Sheet, Rev. 4.1
Freescale Semiconductor
97
Chapter 11
Ordering Information and Mechanical Specifications
11.1 Introduction
The MC68HC705J1A, the RC oscillator, and low-speed option devices described in
Appendix A
MC68HRC705KJ1
and
Appendix B MC68HLC705KJ1
are available in these packages:
648 — Plastic dual in-line package (PDIP)
751G — Small outline integrated circuit (SOIC)
620A — Ceramic DIP (Cerdip) (windowed)
This section contains ordering information and mechanical specifications for the available package types.
11.2 MCU Order Numbers
Table 11-1
lists the MC order numbers.
Table 11-1. Order Numbers
(1)
1. Refer to
Appendix A MC68HRC705KJ1
and
Appendix B MC68HLC705KJ1
for ordering
information on optional low-speed and resistor-capacitor oscillator devices.
2. C = extended temperature range
3. DW = small outline integrated circuit (SOIC)
4. S = ceramic dual in-line package (Cerdip)
Package
Type
Case
Outline
Pin
Count
Operating
Temperature
Order Number
PDIP
648
16
–40 to +85
°
C
MC68HC705KJ1C
(2)
SOIC
751G
16
–40 to +85
°
C
MC68HC705KJ1CDW
(3)
Cerdip
620A
16
–40 to +85
°
C
MC68HC705KJ1CS
(4)
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