參數(shù)資料
型號： KAB04D100M-TLGP
廠商： SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述： Multi-Chip Package MEMORY
中文描述： 多芯片封裝存儲器
文件頁數(shù)： 23/72頁
文件大?。?/td> 1378K
代理商： KAB04D100M-TLGP
KAB0xD100M - TxGP
Revision 1.11
August 2003
- 23 -
MCP MEMORY
SEC Only
Table 12. NOR Flash Memory Block Group Address (Top Boot Block)
Block Group
Block Address
Block
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
BGA0
0
0
0
0
0
0
0
X
X
X
BA0
BGA1
0
0
0
0
0
0
1
X
X
X
BA1 to BA3
1
0
1
1
BGA2
0
0
0
0
1
X
X
X
X
X
BA4 to BA7
BGA3
0
0
0
1
0
X
X
X
X
X
BA8 to BA11
BGA4
0
0
0
1
1
X
X
X
X
X
BA12 to BA15
BGA5
0
0
1
0
0
X
X
X
X
X
BA16 to BA19
BGA6
0
0
1
0
1
X
X
X
X
X
BA20 to BA23
BGA7
0
0
1
1
0
X
X
X
X
X
BA24 to BA27
BGA8
0
0
1
1
1
X
X
X
X
X
BA28 to BA31
BGA9
0
1
0
0
0
X
X
X
X
X
BA32 to BA35
BGA10
0
1
0
0
1
X
X
X
X
X
BA36 to BA39
BGA11
0
1
0
1
0
X
X
X
X
X
BA40 to BA43
BGA12
0
1
0
1
1
X
X
X
X
X
BA44 to BA47
BGA13
0
1
1
0
0
X
X
X
X
X
BA48 to BA51
BGA14
0
1
1
0
1
X
X
X
X
X
BA52 to BA55
BGA15
0
1
1
1
0
X
X
X
X
X
BA56 to BA59
BGA16
0
1
1
1
1
X
X
X
X
X
BA60 to BA63
BGA17
1
0
0
0
0
X
X
X
X
X
BA64 to BA67
BGA18
1
0
0
0
1
X
X
X
X
X
BA68 to BA71
BGA19
1
0
0
1
0
X
X
X
X
X
BA72 to BA75
BGA20
1
0
0
1
1
X
X
X
X
X
BA76 to BA79
BGA21
1
0
1
0
0
X
X
X
X
X
BA80 to BA83
BGA22
1
0
1
0
1
X
X
X
X
X
BA84 to BA87
BGA23
1
0
1
1
0
X
X
X
X
X
BA88 to BA91
BGA24
1
0
1
1
1
X
X
X
X
X
BA92 to BA95
BGA25
1
1
0
0
0
X
X
X
X
X
BA96 to BA99
BGA26
1
1
0
0
1
X
X
X
X
X
BA100 to BA103
BGA27
1
1
0
1
0
X
X
X
X
X
BA104 to BA107
BGA28
1
1
0
1
1
X
X
X
X
X
BA108 to BA111
BGA29
1
1
1
0
0
X
X
X
X
X
BA112 to BA115
BGA30
1
1
1
0
1
X
X
X
X
X
BA116 to BA119
BGA31
1
1
1
1
0
X
X
X
X
X
BA120 to BA123
BGA32
1
1
1
1
1
0
0
X
X
X
BA124 to BA126
0
1
1
0
BGA33
1
1
1
1
1
1
1
0
0
0
BA127
BGA34
1
1
1
1
1
1
1
0
0
1
BA128
BGA35
1
1
1
1
1
1
1
0
1
0
BA129
BGA36
1
1
1
1
1
1
1
0
1
1
BA130
BGA37
1
1
1
1
1
1
1
1
0
0
BA131
BGA38
1
1
1
1
1
1
1
1
0
1
BA132
BGA39
1
1
1
1
1
1
1
1
1
0
BA133
BGA40
1
1
1
1
1
1
1
1
1
1
BA134
相關PDF資料
PDF描述
KAB04D100M-TNGP Multi-Chip Package MEMORY
KAB01D100M Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
KAB02D100M-TLGP Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
KAB01D100M-TNGP CONNECTOR ACCESSORY
KAB02D100M-TNGP CONNECTOR ACCESSORY
相關代理商/技術參數(shù)
參數(shù)描述
KAB04D100M-TNGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB-1 功能描述:保險絲 TRON RECTIFIER FUSE RoHS:否 制造商:Littelfuse 產品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485
KAB-1/2 制造商:COOPER BUSSMANN 功能描述:TRON RECTIFIER FUSE
KAB-10 功能描述:保險絲 10A RoHS:否 制造商:Littelfuse 產品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485
KAB-100 制造商:Cooper Bussmann 功能描述:
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