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參數(shù)資料
| 型號(hào)： | KAB04D100M-TLGP |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | Multi-Chip Package MEMORY |
| 中文描述： | 多芯片封裝存儲(chǔ)器 |
| 文件頁(yè)數(shù)： | 14/72頁(yè) |
| 文件大?。?/td> | 1378K |
| 代理商： | KAB04D100M-TLGP |
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KAB0xD100M - TxGP
Revision 1.11
August 2003
- 14 -
MCP MEMORY
SEC Only
NOTES:
1. RA : Read Address, PA : Program Address, RD : Read Data, PD : Program Data
DA : Dual Bank Address (A20 - A21), BA : Block Address (A12 - A21), X = Don’t care .
2. To terminate the Autoselect Mode, it is necessary to write Reset command to the register.
3. The 4th cycle data of Autoselect mode is output data.
The 3rd and 4th cycle bank addresses of Autoselect mode must be same.
4. The Read / Program operations at non-erasing blocks and the autoselect mode are allowed in the Erase Suspend mode.
5. The Erase Suspend command is applicable only to the Block Erase operation.
6. Command is valid when the device is in read mode or Autoselect mode.
7. DQ8 - DQ15 are don’t care in command sequence, but RD and PD is excluded.
8. A11 - A21 are also don’t care, except for the case of special notice.
Table 6. NOR Flash Memory Autoselect Codes
NOTES:
1. L=Logic Low=V
IL
, H=Logic High=V
IH
, DA=Dual Bank Address, BA=Block Address, X=Don’t care
.
2. Secode Block : Security Code Block.
Description
DQ8 to DQ15
DQ7 to DQ0
BYTE = V
IH
BYTE = V
IL
Manufacturer ID
X
X
ECH
Device Code KAB02D100 (Top Boot Block)
22H
X
E0H
Device Code KAB01D100 (Bottom Boot Block)
22H
X
E2H
Device Code KAB04D100 (Top Boot Block)
22H
X
E1H
Device Code KAB03D100 (Bottom Boot Block)
22H
X
E3H
Block Protection Verification
X
X
01H (Protected),
00H (Unprotected)
Secode
Block Indicator Bit (DQ7)
X
X
80H (Factory locked),
00H (Not factory locked)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| KAB04D100M-TNGP | Multi-Chip Package MEMORY |
| KAB01D100M | Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel |
| KAB02D100M-TLGP | Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel |
| KAB01D100M-TNGP | CONNECTOR ACCESSORY |
| KAB02D100M-TNGP | CONNECTOR ACCESSORY |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| KAB04D100M-TNGP | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY |
| KAB-1 | 功能描述:保險(xiǎn)絲 TRON RECTIFIER FUSE RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險(xiǎn)絲類型:Fast Acting 保險(xiǎn)絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
| KAB-1/2 | 制造商:COOPER BUSSMANN 功能描述:TRON RECTIFIER FUSE |
| KAB-10 | 功能描述:保險(xiǎn)絲 10A RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險(xiǎn)絲類型:Fast Acting 保險(xiǎn)絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485 |
| KAB-100 | 制造商:Cooper Bussmann 功能描述: |
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