參數(shù)資料
型號(hào): KAB01D100M-TNGP
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: CONNECTOR ACCESSORY
中文描述: 連接器附件
文件頁(yè)數(shù): 58/72頁(yè)
文件大小: 1378K
代理商: KAB01D100M-TNGP
KAB0xD100M - TxGP
Revision 1.11
August 2003
- 58 -
MCP MEMORY
SEC Only
Block Group Protect & Unprotect Operations
NOR Flash SWITCHING WAVEFORMS
CE
R
Temporary Block Group Unprotect
Program or Erase Command Sequence
RESET
WE
t
RSP
R/B
R
t
VID
V
ID
V
ss
,V
IL
,
or V
IH
V
ss
,V
IL
,
or V
IH
t
RRB
t
VID
BGA,A6
A1,A0
RESET
CE
R
WE
DATA
OE
V
ss
,V
IL
,
or V
IH
60H
60H
40H
Status*
Block Group Protect / Unprotect
Verify
1
μ
s
Block Group Protect:150
μ
s
Block Group UnProtect:15ms
NOTES:
Block Group Protect (A6=
V
IL
, A1=
V
IH
, A0=
V
IL
) , Status=01H
Block Group Unprotect (A6=
V
IH
, A1=
V
IH
,
A0=
V
IL
) , Status=00H
BGA = Block Group Address (A12 ~ A21)
R/B
R
V
ID
Valid
Valid
Valid
t
BUSY
t
RB
V
ss
,V
IL
,
or V
IH
相關(guān)PDF資料
PDF描述
KAB02D100M-TNGP CONNECTOR ACCESSORY
KAB3403DN White LED Step-Up Converter
KAB3403T White LED Step-Up Converter
KAB3405T Step Up Type DC/DC Converter for White LED
KAC-749S 4-Channel power amplifier
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
KAB02D100M-TLGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB02D100M-TNGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB03D100M-TLGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB03D100M-TNGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB04D100M-TLGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY