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參數(shù)資料
| 型號(hào)： | K4N26323AE-GC20 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | 128Mbit GDDR2 SDRAM |
| 中文描述： | 128Mbit GDDR2 SDRAM的 |
| 文件頁數(shù)： | 22/52頁 |
| 文件大?。?/td> | 826K |
| 代理商： | K4N26323AE-GC20 |
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- 22 -
Rev. 1.7 (Jan. 2003)
128M GDDR2 SDRAM
K4N26323AE-GC
Auto-Precharge Operation
Before a new row in an active bank can be opened, the active bank must be precharged using either the Precharge
Command or the auto-precharge function. When a Read or a Write Command is given to the GDDR2 SDRAM, the CAS
timing accepts one extra address, column address A8, to allow the active bank to automatically begin precharge at the
earliest possible moment during the burst read or write cycle. If A8 is low when the READ or WRITE Command is
issued, then normal Read or Write burst operation is executed and the bank remains active at the completion of the
burst sequence. If A8 is high when the Read or Write Command is issued, then the auto-precharge function is engaged.
This feature allows the precharge operation to be partially or completely hidden during burst read cycles (dependent
upon CAS latency) thus improving system performance for random data access. The RAS lockout circuit internally
delays the Precharge operation until the array restore operation has been completed so that the auto precharge com-
mand may be issued with any read or write command.
Auto-precharge also be implemented during Write commands. The precharge operation engaged by the Auto precharge
command will not begin until the last data of the burst write sequence is properly stored in the memory array.
The DDR SDRAM has a Data mask function that can be used in conjunction with data Write cycle only, not Read cycle.
When the Data Mask is activated (DM high) during write operation the write data is masked immediately (DM to Data-mask
Latency is zero).
DM must be issued at the rising edge or the falling edge of Data Strobe instead of a clock edge.
DM FUNCTION
DM
masked by DM=H
CMD
NOP
NOP
NOP
NOP
NOP
NOP
DQ’s
NOP
CK, CK
0
2
1
3
4
5
6
9
WRITE A
Posted CAS
Precharge A
t
WR
= 5
DINA
0
DINA
2
DINA
3
DQS
DINA1
WL = 2
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| K4N26323AE-GC22 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:128Mbit GDDR2 SDRAM |
| K4N26323AE-GC25 | 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:128Mbit GDDR2 SDRAM |
| K4N27 | 制造商:KODENSHI 制造商全稱:KODENSHI KOREA CORP. 功能描述:Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) |
| K4N28 | 制造商:KODENSHI 制造商全稱:KODENSHI KOREA CORP. 功能描述:Photocoupler(These Photocouplers consist of a Gallium Arsenide Infrared Emitting) |
| K4N29 | 制造商:KODENSHI 制造商全稱:KODENSHI KOREA CORP. 功能描述:Photocoupler(These Photocouplers cosist of a Gallium Arsenide Infrared Emitting) |
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