- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385432 > HYB18L128160BF (QIMONDA) DRAMs for Mobile Applications 128-Mbit Mobile-RAM PDF資料下載
參數(shù)資料
| 型號： | HYB18L128160BF |
| 廠商： | QIMONDA |
| 英文描述： | DRAMs for Mobile Applications 128-Mbit Mobile-RAM |
| 中文描述： | 針對移動應用的DRAM 128 - Mbit的移動RAM |
| 文件頁數(shù)： | 12/55頁 |
| 文件大?。?/td> | 1399K |
| 代理商： | HYB18L128160BF |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁當前第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁
Data Sheet
12
Rev. 1.71, 2007-01
05282004-NZNK-8T0D
HY[B/E]18L128160B[C/F]-7.5
128-Mbit Mobile-RAM
Functional DescriptionState Diagram
2.2.1.6
Partial Array Self Refresh (PASR)
Partial Array Self Refresh is a power-saving feature specific to Mobile RAMs. With PASR, self refresh may be
restricted to variable portions of the total array. The selection comprises all four banks, two banks, one bank, half
of one bank, and a quarter of one bank. Data written to the non activated memory sections will get lost after a
period defined by t
REF
(cf.
Table 14
).
2.2.1.7
Temperature Compensated Self Refresh (TCSR) with On-Chip Temperature
Sensor
DRAM devices store data as electrical charge in tiny capacitors that require a periodic refresh in order to retain
the stored information. This refresh requirement heavily depends on the die temperature: high temperatures
correspond to short refresh periods, and low temperatures correspond to long refresh periods.
The Mobile-RAM is equipped with an on-chip temperature sensor which continuously senses the actual die
temperature and adjusts the refresh period in Self Refresh mode accordingly. This makes any programming of the
TCSR bits in the Extended Mode Register obsolete. It also is the superior solution in terms of compatibility and
power-saving, because
it is fully compatible to all processors that do not support the Extended Mode Register
it is fully compatible to all applications that only write a default (worst case) TCSR value, e.g. because of the
lack of an external temperature sensor
it does not require any processor interaction for regular TCSR updates
2.2.1.8
Selectable Drive Strength
The drive strength of the DQ output buffers is selectable via bits A5 and A6 and shall be set load dependent. The
half drive strength is suitable for typical Mobile-RAM applications. The full drive strength is intended for heavier
loaded systems. I-V curves for full drive strength and half drive strength can be found in
Table 24
.
2.3
State Diagram
PAS
R
[2:0]
w
Partial Array Self Refresh
000
B
all banks (default)
001
B
1/2 array (BA1 = 0)
010
B
1/4 array (BA1 = BA0 = 0)
101
B
1/8 array (BA1 = BA0 = RA11 = 0)
110
B
1/16 array (BA1 = BA0 = RA11 = RA10 = 0)
Note:All other bit combinations are RESERVED.
Field
Bits
Type
Description
相關PDF資料 |
PDF描述 |
|---|---|
| HYB18L256160B | DRAMs for Mobile Applications 256-Mbit Mobile-RAM |
| HYMP112S64LMP8-C4 | DDR2 SDRAM SO-DIMM |
| HYMP112S64LMP8-C5 | DDR2 SDRAM SO-DIMM |
| HYMP112S64LMP8-E3 | BNC FEMALE TO RCA MALE COUPLER |
| HYMP112S64LMP8-E4 | DDR2 SDRAM SO-DIMM |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HYB18L128160BF-7.5 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:BJAWBMSpecialty DRAMs Mobile-RAM |
| HYB18L128160BF-75 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:DRAMs for Mobile Applications |
| HYB18L256160B | 制造商:QIMONDA 制造商全稱:QIMONDA 功能描述:DRAMs for Mobile Applications 256-Mbit Mobile-RAM |
| HYB18L256160BC-7.5 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:BJAWBMSpecialty DRAMs Mobile-RAM |
| HYB18L256160BC-75 | 制造商:INFINEON 制造商全稱:Infineon Technologies AG 功能描述:DRAMs for Mobile Applications |
發(fā)布緊急采購，3分鐘左右您將得到回復。