參數(shù)資料
型號： celeron cpu Mobile Module
廠商： Intel Corp.
英文描述： processor Mobile Module Connector 1 (MMC-1) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器1處理器)
中文描述： 移動處理器模塊連接器1（MMC管理- 1）在466 MHz和433MHz的（工作頻率466和433兆赫茲帶連接器1處理器）
文件頁數(shù)： 40/42頁
文件大?。?/td> 448K
代理商： CELERON CPU MOBILE MODULE
36
Celeron
Processor Mobile Module MMC-1
at 466 MHz and 433 MHz
Hole detail, 3 places
0.762 mm width of EMI containment ring
1.27+/- 0.19 mm board edge to EMI ring
2.54+/-0.19 mm keep-out area
3.81+/-0.19 mm board edge to hole centerline
3.81+/-0.19 mm
4.45 mm diameter grounded ring
+ 0.050 mm
- 0.025 mm
hole diameter
2.413 mm
Figure 16. Standoff Holes, Board Edge Clearance, and EMI Containment Ring (Topside)
5.3.2
Module Weight
The Celeron processor mobile module MMC-1 weighs
approximately 50 grams.
6.0
THERMAL SPECIFICATION
6.1
Thermal Design Power
The typical TDP is the typical total power dissipation under
normal operating conditions at nominal V_CORE (CPU
power supply) while executing the worst case power
instruction mix. The power handling capability of the system
thermal solution may be reduced less than the
recommended typical thermal design power with the
implementation of firmware/software control or “throttling”
that reduces CPU power consumption and dissipation. This
includes the power dissipated by
all
of the relevant
components. During all operating environments, the
processor junction temperature, T
J
, must be within the range
of 0 Celsius to 100 Celsius.
6.2
Thermal Sensor Setpoint
The thermal sensor implements the SMBALERT# signal
described in the SMBus specification. SMBALERT# is
always asserted when the temperature of the processor core
thermal diode or the thermal sensor internal temperature
exceeds either the upper or lower temperature thresholds.
SMBALERT# may also be asserted if the measured
temperature equals either the upper or the lower threshold.
Table 24. Thermal Design Power Specifications
Parameter
Typical
14.3
Symbol
Notes
TDP
module
CPU Thermal Design Power
TDP
module
BX Thermal Design Power
2.3
TDP
module
Module Thermal Design Power
17.4
Module TDP = core, 82433BX, and voltage regulator
NOTE:
1. During all operating environments, the processor temperature, T
J
must be within the specified range of 0 Celsius to 100 Celsius.
2.
TDP
module
is a thermal solution design reference point for OEM thermal solution readiness for total module power.
相關(guān)PDF資料
PDF描述
celeron CPU with Mobile Module processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器)
Celeron Processor with mobile Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器)
celeron processor 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器)
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