參數(shù)資料
型號(hào)： celeron cpu Mobile Module
廠商： Intel Corp.
英文描述： processor Mobile Module Connector 1 (MMC-1) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器1處理器)
中文描述： 移動(dòng)處理器模塊連接器1（MMC管理- 1）在466 MHz和433MHz的（工作頻率466和433兆赫茲帶連接器1處理器）
文件頁數(shù)： 3/42頁
文件大小： 448K
代理商： CELERON CPU MOBILE MODULE
i
Celeron
Processor Mobile Module MMC-1
at 466 MHz and 433 MHz
CONTENTS
1.0 INTRODUCTION...........................................................1
1.1
Revision History....................................................1
2.0 ARCHITECTURE OVERVIEW......................................1
3.0 CONNECTOR INTERFACE..........................................3
3.1
Signal Definition....................................................3
3.1.1 Signal List.......................................................4
3.1.2 Memory (108 Signals).....................................5
3.1.3. PCI (56 Signals)..............................................6
3.1.4 Processor and PIIX4E/M Sideband (9 Signals)6
3.1.5 Power Management (8 Signals)......................8
3.1.6 Clock (8 Signals).............................................9
3.1.7 Voltages (39 Signals)....................................10
3.1.8 JTAG (7 Signals)..........................................10
3.1.9 Miscellaneous (45 Signals)...........................11
3.2
Connector Pin Assignments................................12
3.3
Pin and Pad Assignments...................................14
4.0 FUNCTIONAL DESCRIPTION....................................15
4.1
Celeron Processor Mobile Module MMC-1..........15
4.2
L2 Cache............................................................15
4.3
The 82443DX Host Bridge System Controller.....15
4.3.1 Memory Organization...................................15
4.3.2 Reset Strap Options .....................................15
4.3.3 PCI Interface.................................................16
4.3.4 AGP Feature Set...........................................16
4.4
Power Management............................................16
4.4.1 Clock Control Architecture............................16
4.4.2 Normal State.................................................18
4.4.3 Auto Halt State..............................................18
4.4.4 Stop Grant State...........................................18
4.4.5 Quick Start State...........................................18
4.4.6 HALT/Grant Snoop State..............................18
4.4.7 Sleep State...................................................18
4.4.8 Deep Sleep State..........................................19
4.5
Typical POS/STR Power..............................19
Electrical Requirements......................................19
4.6.1 DC Requirements .........................................19
4.6.2 AC Requirements..........................................21
4.6.2.1 BCLK Signal Quality Specifications
and Measurement Guidelines ..........22
The Voltage Regulator........................................22
4.7.1 Voltage Regulator Efficiency.........................22
4.7.2. Control of the Voltage Regulator...................23
4.7.2.1 Voltage Signal Definition and
Sequencing......................................24
4.7.3 Power Planes: Bulk Capacitance
Requirements................................................25
4.7.4 Surge Current Guidelines .............................26
4.7.4.1 Slew-rate Control: Circuit Description
.........................................................28
4.7.4.2 Undervoltage Lockout: Circuit
Description (V_uv_lockout)..............29
4.7.4.3 Overvoltage Lockout: Circuit
Description (V_ov_lockout)..............30
4.7.4.4 Overcurrent Protection: Circuit
Description.......................................30
Active Thermal Feedback...................................30
Thermal Sensor Configuration Register..............31
5.0 MECHANICAL SPECIFICATION................................31
5.1
Module Dimensions ............................................31
5.1.1 MMC-1 Connector Pin 1 Location.................32
5.1.2 Printed Circuit Board Thickness....................32
5.1.3 Height Restrictions .......................................33
5.2
Thermal Transfer Plate........................................33
5.3
Physical Support.................................................35
5.3.1 Mounting Requirements................................35
5.3.2 Module Weight..............................................36
6.0 THERMAL SPECIFICATION......................................36
6.1
Thermal Design Power.......................................36
6.2
Thermal Sensor Setpoint....................................36
7.0 LABELING INFORMATION.......................................37
8.0 ENVIRONMENTAL STANDARDS..............................38
4.6
4.7
4.8
4.9
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