參數(shù)資料
型號: celeron cpu Mobile Module
廠商: Intel Corp.
英文描述: processor Mobile Module Connector 1 (MMC-1) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器1處理器)
中文描述: 移動處理器模塊連接器1(MMC管理- 1)在466 MHz和433MHz的(工作頻率466和433兆赫茲帶連接器1處理器)
文件頁數(shù): 38/42頁
文件大?。?/td> 448K
代理商: CELERON CPU MOBILE MODULE
34
Celeron
Processor Mobile Module MMC-1
at 466 MHz and 433 MHz
manufacturer can attach a heat pipe, a heat spreader plate,
or a thermal solution to transfer heat through the notebook
system. See Figure 14 and Figure 15 for attachment
dimensions from the thermal interface block to the TTP.
When attaching the mating block to the TTP, a thermal
elastomer or thermal grease should be used. This material
reduces the thermal resistance. The OEM thermal interface
block should be secured with 2.0-millimeter screws using a
maximum torque of 1.5 Kg*cm to 2.0 Kg*cm (equivalent to
0.147 N*m to.197 N*m). The thread length of the 2.00-
millimeter screws should be 2.25-millimeter gageable thread
(2.25-millimeters minimum to 2.80-millimeters maximum).
The system manufacturer should use the exact dimensions
for maximum contact area to the TTP to ensure that no
warpage of the TTP occurs. If warpage occurs, the thermal
resistance of the module could be adversely affected.
The TTP thermal resistance between the processor core to
the system interface (top of the TTP) is less than 1 Celsius
per watt.
Figure 14. Thermal Transfer Plate (A)
相關(guān)PDF資料
PDF描述
celeron CPU with Mobile Module processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器)
Celeron Processor with mobile Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器)
celeron processor 32 bit Celeron Processor Mobile Module(32 位帶移動模塊處理器)
CEM11C2 Dual Enhancement Mode Field Effect Transistor (N and P Channel)
CEM2005 Dual Enhancement Mode Field Effect Transistor(N and Channel)
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