參數(shù)資料
型號(hào): celeron cpu Mobile Module
廠商: Intel Corp.
英文描述: processor Mobile Module Connector 1 (MMC-1) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器1處理器)
中文描述: 移動(dòng)處理器模塊連接器1(MMC管理- 1)在466 MHz和433MHz的(工作頻率466和433兆赫茲帶連接器1處理器)
文件頁數(shù): 37/42頁
文件大?。?/td> 448K
代理商: CELERON CPU MOBILE MODULE
33
Celeron
Processor Mobile Module MMC-1
at 466 MHz and 433 MHz
min: 0.90 mm
max: 1.10 mm
Printed Circuit Board
Figure 12. Printed Circuit Board Thickness
5.1.3
Height Restrictions
Figure 13 shows the mechanical stack-up and the
associated component clearance requirements. This is
referred to as the module keep-out zone and should not be
entered or altered.
The system manufacturer establishes the board-to-board
clearance between the module and the system electronics
by selecting one of three possible mating connectors. The
mating connector sizes are 4 millimeters, 6 millimeters, or 8
millimeters. These three options provide the system
manufacturer with flexibility in choosing components
between the two boards. Information on these connectors
can be obtained from your local Intel representative.
NOTE
:
The topside component clearance is independent of the PCB thickness.
Figure 13. Keep-out Zone
5.2
Thermal Transfer Plate
The TTP on the CPU and the 82433BX provides heat
dissipation and a thermal attach point where a system
相關(guān)PDF資料
PDF描述
celeron CPU with Mobile Module processor Mobile Module Connector 2 (MMC-2) at 466 MHz and 433MHZ(工作頻率466和433兆赫茲帶連接器2處理器)
Celeron Processor with mobile Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器1處理器)
celeron processor 32 bit Celeron Processor Mobile Module(32 位帶移動(dòng)模塊處理器)
CEM11C2 Dual Enhancement Mode Field Effect Transistor (N and P Channel)
CEM2005 Dual Enhancement Mode Field Effect Transistor(N and Channel)
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