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參數(shù)資料
| 型號： | W25Q64BVSSIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 8M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 0.208 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件頁數(shù)： | 58/61頁 |
| 文件大?。?/td> | 1726K |
| 代理商： | W25Q64BVSSIG |
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W25Q64BV
Publication Release Date: July 08, 2010
- 61 -
Revision E
15. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
08/24/08
New Create Preliminary
B
01/15/09
03/12/09
3/13/09
56 & 57
57
5
13
P character added to end of a Part Number
Corrected Top Side Marking
Changed Active Current to 4mA
Typo Change QE pin to QE bit
C
08/20/09
38, 39, 54~56 &
58
44
Update Erase Suspend and Resume description.
Update Package Diagrams
UID Waveform Corrected
D
09/24/09
52
5,7,55,58,59
44
46
Change fR = 33Mhz
Added PDIP Package
Corrected Read Manufacturer / Device ID Fig 27.
Corrected Read JEDEC ID, Fig 29
E
07/08/10
61
55-58
50, 53
Removed Preliminary designator
Updated package diagrams
Updated parameter VIL/VIH, tBP1, tSE
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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PDF描述 |
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| WF2M32S-100HM | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
| WF2M32S-100HC | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q64BVSSIGTR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM |
| W25Q64BVSSIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64BVZEIG | 功能描述:IC SPI FLASH 64MBIT 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
| W25Q64BVZEIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CV | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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