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參數(shù)資料
| 型號(hào)： | W25Q64BVSSIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 8M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 0.208 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件頁(yè)數(shù)： | 13/61頁(yè) |
| 文件大?。?/td> | 1726K |
| 代理商： | W25Q64BVSSIG |
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W25Q64BV
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11.2.4 Write Enable (06h)
The Write Enable instruction (Figure 4) sets the Write Enable Latch (WEL) bit in the Status Register to a
1. The WEL bit must be set prior to every Page Program, Sector Erase, Block Erase, Chip Erase and
Write Status Register instruction. The Write Enable instruction is entered by driving /CS low, shifting the
instruction code “06h” into the Data Input (DI) pin on the rising edge of CLK, and then driving /CS high.
Figure 4. Write Enable Instruction Sequence Diagram
11.2.5 Write Disable (04h)
The Write Disable instruction (Figure 5) resets the Write Enable Latch (WEL) bit in the Status Register to
a 0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code “04h” into the
DI pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon
completion of the Write Status Register, Page Program, Sector Erase, Block Erase and Chip Erase
instructions.
Figure 5. Write Disable Instruction Sequence Diagram
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| WE128K8-250CCA | EEPROM 5V MODULE, CDIP32 |
| W25Q16CVTCAG | 16M X 1 SPI BUS SERIAL EEPROM, PBGA24 |
| WF2M32S-100HM | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
| WF2M32S-100HC | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
| WF2M32S-120GTC | 8M X 8 FLASH 5V PROM MODULE, 120 ns, CQFP68 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q64BVSSIGTR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM |
| W25Q64BVSSIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64BVZEIG | 功能描述:IC SPI FLASH 64MBIT 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR) |
| W25Q64BVZEIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CV | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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