參數(shù)資料
型號: W25Q64BVSSIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 8M X 8 SPI BUS SERIAL EEPROM, PDSO8
封裝: 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù): 57/61頁
文件大?。?/td> 1726K
代理商: W25Q64BVSSIG
W25Q64BV
- 60 -
14.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q64BV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 10-digit number.
PACKAGE TYPE
DENSITY
PRODUCT NUMBER
TOP SIDE MARKING
SS
SOIC-8 208mil
64M-bit
W25Q64BVSSIG
W25Q64BVSSIP
25Q64BVSIG
25Q64BVSIP
SF
SOIC-16 300mil
64M-bit
W25Q64BVSFIG
W25Q64BVSFIP
25Q64BVFIG
25Q64BVFIP
DA
PDIP-8 300mil
64M-bit
W25Q64BVDAIG
W25Q64BVDAIP
25Q64BVAIG
25Q64BVAIP
ZE
(1)
WSON-8 8x6mm
64M-bit
W25Q64BVZEIG
W25Q64BVZEIP
25Q64BVIG
25Q64BVIP
Note:
1. WSON package type ZE is not used in the top side marking.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q64BVSSIGTR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM
W25Q64BVSSIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64BVZEIG 功能描述:IC SPI FLASH 64MBIT 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)
W25Q64BVZEIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CV 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI