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參數(shù)資料
| 型號： | W25Q64BVSSIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 8M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| 封裝： | 0.208 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件頁數(shù)： | 39/61頁 |
| 文件大?。?/td> | 1726K |
| 代理商： | W25Q64BVSSIG |
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W25Q64BV
- 44 -
11.2.26 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh)
and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown
in figure 27. The Device ID values for the W25Q64BV is listed in Manufacturer and Device Identification
table. If the 24-bit address is initially set to 000001h the Device ID will be read first and then followed by
the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to
the other. The instruction is completed by driving /CS high.
31 32
33 34 35 36 37 38 39
40 41 42 43 44
45 46
31 32
33 34 35 36 37 38 39
40 41 42 43 44
45 46
Figure 27. Read Manufacturer / Device ID Diagram
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PDF描述 |
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| WE128K8-250CCA | EEPROM 5V MODULE, CDIP32 |
| W25Q16CVTCAG | 16M X 1 SPI BUS SERIAL EEPROM, PBGA24 |
| WF2M32S-100HM | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
| WF2M32S-100HC | 8M X 8 FLASH 5V PROM MODULE, 100 ns, CHIP66 |
| WF2M32S-120GTC | 8M X 8 FLASH 5V PROM MODULE, 120 ns, CQFP68 |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| W25Q64BVSSIGTR | 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 64M-BIT, 4KB UNIFORM |
| W25Q64BVSSIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64BVZEIG | 功能描述:IC SPI FLASH 64MBIT 8WSON RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標準包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC（0.173"，4.40mm 寬） 供應商設備封裝:8-MFP 包裝:帶卷 (TR) |
| W25Q64BVZEIP | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
| W25Q64CV | 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI |
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