參數(shù)資料
型號: W25Q64BVSSIG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 8M X 8 SPI BUS SERIAL EEPROM, PDSO8
封裝: 0.208 INCH, GREEN, PLASTIC, SOIC-8
文件頁數(shù): 38/61頁
文件大小: 1726K
代理商: W25Q64BVSSIG
W25Q64BV
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in figure 26, except that after /CS is driven high it must
remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will
resume normal operation and other instructions will be accepted. If the Release from Power-down /
Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals
1) the instruction is ignored and will not have any effects on the current cycle.
Figure 25. Release Power-down/High Performance Mode Instruction Sequence
Figure 26. Release Power-down / Device ID Instruction Sequence Diagram
Publication Release Date: July 08, 2010
- 43 -
Revision E
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