參數(shù)資料
型號(hào)： TDA8754HL/27/C1
廠商： NXP SEMICONDUCTORS
元件分類： ADC
英文描述： 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
封裝： 20 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, MS-026, SOT486-1, LQFP-144
文件頁(yè)數(shù)： 49/57頁(yè)
文件大?。?/td> 259K
代理商： TDA8754HL/27/C1
TDA8754_7
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 07 — 3 May 2007
53 of 57
NXP Semiconductors
TDA8754
Triple 8-bit video ADC up to 270 Msample/s
16.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 13) than a PbSn process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 77 and 78
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 13.
Table 77.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 78.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料
PDF描述
TDA8754HL/14/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
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TDA8754EL/27/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PBGA208
TDA8754HL/11/C1 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
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