參數(shù)資料
型號： IDT88K8483BRI
廠商： IDT, Integrated Device Technology Inc
文件頁數(shù)： 139/162頁
文件大小： 0K
描述： IC SPI-4 EXCHANGE 3PORT 672-BGA
標(biāo)準(zhǔn)包裝： 24
系列： *
其它名稱： 88K8483BRI
78 of 162
October 20, 2006
IDT IDT88K8483
The Indirect Register Accessing scheme:
3 Byte Indirect register Address = 3 Byte Segment Base Address +
2 Byte Module Base Address +
2 Byte Block Base Address +
1 Byte Register Offset
Direct Register Address
(HEX)
Register Size
(Bits)
Used for
Type
0x1a
8
Indirect access control
Read/Write
0x1b
8
Indirect access data (BYTE 0)
Read/Write
0x1c
8
Indirect access data (BYTE 1)
Read/Write
0x1d
8
Indirect access data (BYTE 2)
Read/Write
0x1e
8
Indirect access data (BYTE 3)
Read/Write
0x1f
8
Indirect access address (BYTE 0)
Read/Write
0x20
8
Indirect access address (BYTE 1)
Read/Write
0x21
8
Indirect access address (BYTE 2)
Read/Write
Address Name
No of
Bytes
Description
Segment Base
3
Address based on User Registers or IDT reserved registers.
Module Base
2
Address based on Module A, B or Common module which includes the SPI4 interfaces, PFPs
and associated PMONs, insert, extract registers.
Block Base
2
Address based on blocks of registers related to SPI4 Ingress and Egress interfaces, related
PFPs and PMONs, Auxillary interface, Processor interface.
Register Offset
1
Address of the individual registers for each Block Base.
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參數(shù)描述
IDT88P8341BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝
IDT88P8341BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝
IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 類別:集成電路 (IC) >> 專用 IC 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:1 系列:- 類型:調(diào)幀器 應(yīng)用:數(shù)據(jù)傳輸 安裝類型:表面貼裝 封裝/外殼:400-BBGA 供應(yīng)商設(shè)備封裝:400-PBGA（27x27） 包裝:散裝
IDT88P8344 制造商:IDT 制造商全稱:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
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