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參數(shù)資料
| 型號(hào)： | GS4576S09L-25 |
| 廠商： | GSI TECHNOLOGY |
| 元件分類： | DRAM |
| 英文描述： | DDR DRAM, PBGA144 |
| 封裝： | UBGA-144 |
| 文件頁數(shù)： | 35/64頁 |
| 文件大小： | 2691K |
| 代理商： | GS4576S09L-25 |
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Preliminary
GS4576S09/18L
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Rev: 1.01 4/2011
40/64
2011, GSI Technology
Recommended Operating Temperature and Thermal Impedance
Like any other semiconcuctor device, the LLDRAM II must be operated within the temperature specifications shown in the
Temperature Limits table for the device to meet datasheet specifications. The thermal impedance characteristics of the device are
are listed below. In applications where the ambient temperature or PCB temperature are too high, use of forced air and/or heat
sinks may be required in order to satisfy the case temperature specifications.
Temperature Limits
Parameter
Temperature
Range
Symbol
Min.
Max.
Unit
Notes
Operating junction temperature
Commercial
TJ
0
+100
C°
1
Industrial
–40
+100
C°
1
Operating case temperature
Commercial
TC
0
+95
C°
2, 3
Industrial
–40
+95
C°
2, 3, 4
Notes:
1. Junction temperature depends upon package type, cycle time, loading, ambient temperature, and airflow.
2. Maximum operating case temperature, TC, is measured in the center of the package.
3. Device functionality is not guaranteed if the device exceeds maximum TC during operation.
4. Junction and case temperature specifications must be satisfied.
Thermal Impedance
Package
Test PCB
Substrate
θ JA (C°/W)
Airflow = 0 m/s
θ JA (C°/W)
Airflow = 1 m/s
θ JA (C°/W)
Airflow = 2 m/s
θ JB (C°/W)
θ JC (C°/W)
μBGA
2-layer
TBD
4-layer
TBD
Notes:
1. Thermal Impedance data is based on a number of of samples from mulitple lots and should be viewed as a typical number.
2. Please refer to JEDEC standard JESD51-6.
3. The characteristics of the test fixture PCB influence reported thermal characteristics of the device. The minimal metalization of a 2-layer
board tends to minimize the utility of the junction-to-board heat path. The 4-layer test fixture PCB is intended to highlight the effect of
connection to power planes typically found in the PCBs used in most applications. Be advised that a good thermal path to the PCB can
result in cooling or heating of the RAM depending on PCB temperature.
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