參數(shù)資料
型號(hào)： Celeron Processor with mobile
廠商： Intel Corp.
英文描述： Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器1處理器)
中文描述： 賽揚(yáng)處理器的移動(dòng)模塊絲裂霉素在400兆赫，366兆赫，333兆赫和300兆赫1（工作頻率四千〇三億六千六百三十三萬(wàn)三千三百和266兆赫茲帶移動(dòng)模塊和連接器1處理器）
文件頁(yè)數(shù)： 40/42頁(yè)
文件大?。?/td> 449K
代理商： CELERON PROCESSOR WITH MOBILE
40
Intel
a
Celeron
Processor Mobile Module MMC-1
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
Hole detail, 3 places
0.762 mm width of EMI containment ring
1.27+/- 0.19 mm board edge to EMI ring
2.54+/-0.19 mm keep-out area
3.81+/-0.19 mm board edge to hole centerline
3.81+/-0.19 mm
4.45 mm diameter grounded ring
+ 0.050 mm
- 0.025 mm
hole diameter
2.413 mm
Figure 16. Standoff Holes, Board Edge Clearance, and EMI Containment Ring (Topside)
5.3.2
Module Weight
The Celeron processor mobile module MMC-1 weighs
approximately 50 grams.
6.0
THERMAL SPECIFICATION
6.1
Thermal Design Power
The typical TDP is the typical total power dissipation under
normal operating conditions at nominal V_CORE (CPU
power supply) while executing the worst case power
instruction mix. The power handling capability of the system
thermal solution may be reduced less than the
recommended typical thermal design power with the
implementation of firmware/software control or “throttling”
that reduces CPU power consumption and dissipation. This
includes the power dissipated by
all
of the relevant
components. During all operating environments, the
processor junction temperature, T
J
, must be within the range
of 0 Celsius to 100 Celsius.
6.2
Thermal Sensor Setpoint
The thermal sensor implements the SMBALERT# signal
described in the SMBus specification. SMBALERT# is
always asserted when the temperature of the processor core
thermal diode or the thermal sensor internal temperature
exceeds either the upper or lower temperature thresholds.
SMBALERT# may also be asserted if the measured
temperature equals either the upper or the lower threshold.
Table 24. Thermal Design Power Specifications
Parameter
Symbol
Typical
11.5 W
Notes
TDP
module
Thermal Design Power
Module = core, 82443DX, and voltage regulator.
NOTE:
1.
During all operating environments, the processor temperature, T
J
must be within the specified range of 0 Celsius to 100 Celsius.
2.
TDP
module
is a thermal solution design reference point for OEM thermal solution readiness for total module power.
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