參數(shù)資料
型號(hào): Celeron Processor with mobile
廠商: Intel Corp.
英文描述: Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器1處理器)
中文描述: 賽揚(yáng)處理器的移動(dòng)模塊絲裂霉素在400兆赫,366兆赫,333兆赫和300兆赫1(工作頻率四千〇三億六千六百三十三萬(wàn)三千三百和266兆赫茲帶移動(dòng)模塊和連接器1處理器)
文件頁(yè)數(shù): 39/42頁(yè)
文件大?。?/td> 449K
代理商: CELERON PROCESSOR WITH MOBILE
39
Intel
a
Celeron
Processor Mobile Module MMC-1
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
Figure 15. Thermal Transfer Plate (B)
5.3
Physical Support
5.3.1
Mounting Requirements
Three mounting holes are available for securing the module
to the system base. See Figure 11 for mounting hole
locations. These hole locations and board edge clearances
will remain fixed for all Intel mobile modules. Intel
recommends that all three mounting holes are used to
ensure long term mechanical reliability and EMI integrity of
the system.
The board edge clearance includes a 0.762 millimeters
(0.030 inches) wide EMI containment ring around the
perimeter of the module. This ring is on each layer of the
module PCB and is grounded. On the surface of the module,
the metal is exposed for EMI shielding purposes. The hole
patterns placed on the module also have a plated
surrounding ring, which can be used with a metal standoff for
EMI shielding purposes. Standoffs should be used to provide
support for the installed Celeron processor mobile module.
The distance from the bottom of the module PCB to the top
of the OEM system electronics board with the connectors
mated is 4.0 millimeters +0.16 millimeters / -0.13 millimeters.
However the warpage of the baseboard can vary and should
be calculated into the final dimensions of the standoffs used.
All calculations can be made with the
Intel
a
MMC-1
Standoff/Receptacle Height
Spreadsheet
. Information on this
spreadsheet can be obtained from your local Intel
representative. Figure 16 shows the standoff support hole
patterns, the board edge clearance, the dimensions of the
EMI containment ring, and the keep-out area.
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