參數(shù)資料
型號: Celeron Processor with mobile
廠商: Intel Corp.
英文描述: Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器)
中文描述: 賽揚(yáng)處理器的移動模塊絲裂霉素在400兆赫,366兆赫,333兆赫和300兆赫1(工作頻率四千〇三億六千六百三十三萬三千三百和266兆赫茲帶移動模塊和連接器1處理器)
文件頁數(shù): 36/42頁
文件大小: 449K
代理商: CELERON PROCESSOR WITH MOBILE
36
Intel
a
Celeron
Processor Mobile Module MMC-1
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
5.1.1
MMC-1 Connector Pin 1 Location
Figure 11 shows the location of pin 1 of the connector as
referenced to the adjacent mounting hole.
Figure 11. Celeron Processor Mobile Module MMC-1 Board Dimensions- Pin 1 Orientation
5.1.2
Printed Circuit Board Thickness
Figure 12 shows the minimum and maximum thickness of
the printed circuit board (PCB). The range of PCB thickness
allows for the use of different PCB technologies with current
and future Intel mobile modules.
Note:
Ensure that the mechanical restraining method or
system-level EMI contacts are able to support this range of
PCB thickness for compatibility with future Intel mobile
modules.
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