參數(shù)資料
型號(hào)： Celeron Processor with mobile
廠商： Intel Corp.
英文描述： Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器1處理器)
中文描述： 賽揚(yáng)處理器的移動(dòng)模塊絲裂霉素在400兆赫，366兆赫，333兆赫和300兆赫1（工作頻率四千〇三億六千六百三十三萬(wàn)三千三百和266兆赫茲帶移動(dòng)模塊和連接器1處理器）
文件頁(yè)數(shù)： 4/42頁(yè)
文件大?。?/td> 449K
代理商： CELERON PROCESSOR WITH MOBILE
4
Intel
a
Celeron
Processor Mobile Module MMC-1
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
FIGURES
Figure 1. Block Diagram of the Celeron Processor
Mobile Module MMC-1...........................................6
Figure 2. 280-Pin Connector Footprint Pad Numbers,
Module Secondary Side.......................................18
Figure 3. Clock Control States ............................................21
Figure 4. BCLK, TCK, and PICCLK Generic Clock Waveform
at the Processor Core Pin....................................26
Figure 5. Power-on Sequence Timing.................................29
Figure 6. Instantaneous In-rush Current Model...................30
Figure 7. Instantaneous In-rush Current.............................31
Figure 8. Over Current Protection Circuit............................32
Figure 9. Spice Simulation Using In-rush Protection
(Example Only)....................................................33
Figure 10. Celeron Processor Mobile Module MMC-1 Board
Dimensions........................................................35
Figure 11. Celeron Processor Mobile Module MMC-1 Board
Dimensions- Pin 1 Orientation............................36
Figure 12. Printed Circuit Board Thickness.........................37
Figure 13. Keep-out Zone...................................................37
Figure 14. Thermal Transfer Plate (A) ................................38
Figure 15. Thermal Transfer Plate (B) ................................39
Figure 16. Standoff Holes, Board Edge Clearance, and EMI
Containment Ring..............................................40
Figure 17. Product Tracking Code......................................41
TABLES
Table 1. Module Connector Signal Summary........................7
Table 2. Memory Signal Descriptions ...................................9
Table 3. PCI Signal Description..........................................10
Table 4. Processor/PIIX4E/M Sideband Signal
Descriptions..........................................................11
Table 5. Power Management Signal Descriptions ..............12
Table 6. Clock Signal Descriptions .....................................13
Table 7. Voltage Descriptions .............................................14
Table 8. JTAG Pins.............................................................14
Table 9. Miscellaneous Pins ...............................................15
Table 10. Connector Pin Assignments................................16
Table 11. Connector Specifications ....................................19
Table 12. Configuration Straps for the 82443DX Host Bridge
System Controller...............................................20
Table 13. Clock State Characteristics.................................23
Table 14. POS/STR Power.................................................23
Table 15. Power Supply Design Specifications
..................24
Table 16. AC Specifications (BCLK) at the Processor Core
Pins.....................................................................25
Table 17. BCLK Signal Quality Specifications at the
Processor Core...................................................26
Table 18. Typical Voltage Regulator Efficiency...................27
Table 19. Voltage Signal Definitions and Sequences .........28
Table 20. VR_ON In-rush Current......................................29
Table 21. Capacitance Requirements per Power Plane......30
Table 22. Thermal Sensor SMBus Address Table..............34
Table 23. Thermal Sensor Configuration Register..............35
Table 24. Thermal Design Power Specifications ................40
Table 25. Environmental Standards....................................42
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