參數(shù)資料
型號: Celeron Processor with mobile
廠商: Intel Corp.
英文描述: Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器)
中文描述: 賽揚處理器的移動模塊絲裂霉素在400兆赫,366兆赫,333兆赫和300兆赫1(工作頻率四千〇三億六千六百三十三萬三千三百和266兆赫茲帶移動模塊和連接器1處理器)
文件頁數(shù): 38/42頁
文件大?。?/td> 449K
代理商: CELERON PROCESSOR WITH MOBILE
38
Intel
a
Celeron
Processor Mobile Module MMC-1
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
5.2
Thermal Transfer Plate
The TTP on the CPU and the 82433BX provides heat
dissipation and a thermal attach point where a system
manufacturer can attach a heat pipe, a heat spreader plate,
or a thermal solution to transfer heat through the notebook
system. See Figure 14 and Figure 15 for attachment
dimensions from the thermal interface block to the TTP.
When attaching the mating block to the TTP, a thermal
elastimer or thermal grease should be used. This material
reduces the thermal resistance. The thermal interface block
should be secured with 2.0-millimeter screws using a
maximum torque of 1.5 Kg*cm to 2.0 Kg*cm (equivalent to
0.147 N*m to.197 N*m). The thread length of the 2.00-
millimeter screws should be 2.25-millimeter gageable thread
(2.25-millimeters minimum to 2.80-millimeters maximum).
The system manufacturer should use the exact dimensions
for maximum contact area to the TTP to ensure that no
warpage of the TTP occurs. If warpage occurs, the thermal
resistance of the module could be adversely affected.
The TTP thermal resistance between the processor core to
the system interface (top of the TTP) is less than 1 Celsius
per watt.
Figure 14. Thermal Transfer Plate (A)
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