參數(shù)資料
型號： Celeron Processor with mobile
廠商： Intel Corp.
英文描述： Celeron Processor Mobile Module MMC-1 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器1處理器)
中文描述： 賽揚處理器的移動模塊絲裂霉素在400兆赫，366兆赫，333兆赫和300兆赫1（工作頻率四千〇三億六千六百三十三萬三千三百和266兆赫茲帶移動模塊和連接器1處理器）
文件頁數(shù)： 3/42頁
文件大小： 449K
代理商： CELERON PROCESSOR WITH MOBILE
3
Intel
a
Celeron
Processor Mobile Module MMC-1
At 400 MHz, 366 MHz, 333 MHz, and 300 MHz
CONTENTS
1.0
INTRODUCTION...................................................5
Revision History................................................5
ARCHITECTURE OVERVIEW..............................5
MODULE CONNECTOR INTERFACE..................7
Signal Definition................................................7
3.1.1
Signal List.................................................8
3.1.2
Memory (108 Signals)...............................9
3.1.3.
PCI (56 Signals)......................................10
3.1.4
Processor and PIIX4E/M Sideband
(9 Signals).............................................11
3.1.5
Power Management (8 Signals)..............12
3.1.6
Clock (8 Signals).....................................13
3.1.7
Voltages (39 Signals)..............................14
3.1.8
JTAG (7 Signals)....................................14
3.1.9
Miscellaneous (45 Signals).....................15
3.2
Connector Pin Assignments............................16
3.3
Pin and Pad Assignments...............................18
FUNCTIONAL DESCRIPTION............................19
4.1
Celeron Processor Mobile Module MMC-1.....19
4.2
L2 Cache........................................................19
4.3
The 82443DX Host Bridge System Controller.19
4.3.1
Memory Organization.............................19
4.3.2
Reset Strap Options ...............................20
4.3.3
PCI Interface...........................................20
4.3.4
AGP Feature Set.....................................20
Power Management............................................20
4.4.1
Clock Control Architecture......................20
4.4.2
Normal State...........................................22
4.4.3
Auto Halt State........................................22
4.4.4
Stop Grant State.....................................22
4.4.5
Quick Start State.....................................22
4.4.6
HALT/Grant Snoop State........................22
4.4.7
Sleep State.............................................22
4.4.8
Deep Sleep State....................................23
1.1
2.0
3.0
3.1
4.0
4.4
4.5
4.6
Typical POS/STR Power.................................23
Electrical Requirements..................................24
4.6.1
DC Requirements ...................................24
4.6.2
AC Requirements....................................25
4.6.2.1
BCLK Signal Quality Specifications and
Measurement Guidelines ....................26
4.7
The Voltage Regulator....................................26
4.7.1
Voltage Regulator Efficiency...................26
4.7.2.
Control of the Voltage Regulator.............27
4.7.2.1
Voltage Signal Definition and
Sequencing.........................................28
4.7.3
Power Planes: Bulk Capacitance
Requirements..........................................29
4.7.4
Surge Current Guidelines .......................30
4.7.4.1
Slew-rate Control: Circuit Description.32
4.7.4.2
Undervoltage Lockout: Circuit
Description (V_uv_lockout).................33
4.7.4.3
Overvoltage Lockout: Circuit Description
(V_ov_lockout)....................................34
4.7.4.4
Overcurrent Protection: Circuit
Description..........................................34
4.8
Active Thermal Feedback...............................34
4.9
Thermal Sensor Configuration Register..........35
MECHANICAL SPECIFICATION........................35
5.1
Module Dimensions ........................................35
5.1.1
MMC-1 Connector Pin 1 Location...........36
5.1.2
Printed Circuit Board Thickness..............36
5.1.3
Height Restrictions .................................37
5.2
Thermal Transfer Plate....................................38
5.3
Physical Support.............................................39
5.3.1
Mounting Requirements..........................39
5.3.2
Module Weight........................................40
THERMAL SPECIFICATION...............................40
6.1
Thermal Design Power...................................40
6.2
Thermal Sensor Setpoint................................40
LABELING INFORMATION.................................41
ENVIRONMENTAL STANDARDS ......................42
5.0
6.0
7.0
8.0
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