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參數(shù)資料
| 型號： | ADV7324 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | Multiformat 216 MHz Video Encoder with Six NSV 14-Bit DACs |
| 中文描述： | 多格式視頻編碼器216兆赫六噪聲整形的14位DAC |
| 文件頁數(shù)： | 63/92頁 |
| 文件大?。?/td> | 992K |
| 代理商： | ADV7324 |
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ADV7324
Rev. 0 | Page 63 of 92
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Figure 88. Filter Plot for Output Filter for PS, 8× Oversampling
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Figure 89. Filter Plot for Output Filter for HDTV, 2× Oversampling
PCB BOARD LAYOUT
The ADV7324 is optimally designed for lowest noise
performance of both radiated and conducted noise. To
complement the excellent noise performance of the ADV7324,
it is imperative that great care be given to the PC board layout.
The layout should be optimized for lowest noise on the
ADV7324 power and ground lines. This can be achieved by
shielding the digital inputs and providing good decoupling. The
lead length between groups of V
AA
and AGND, V
DD
and DGND,
and V
DD_IO
and GND_IO pins should be kept as short as
possible to minimized inductive ringing.
It is recommended that a 4-layer, printed circuit board is used,
with power and ground planes separating the layer of the signal
carrying traces of the components and solder side layer. Com-
ponent placement should be carefully considered to separate
noisy circuits, such as crystal clocks, high speed logic circuitry,
and analog circuitry.
There should be separate analog and digital ground planes.
Each power plane should encompass a digital power plane and
an analog power plane. The analog power plane should contain
the DACs and all associated circuitry, V
REF
circuitry. The digital
power plane should contain all logic circuitry.
The analog and digital power planes should be individually
connected to the common power plane at a single point
through a suitable filtering device, such as a ferrite bead.
DAC output traces on a PCB should be treated as transmission
lines. It is recommended that the DACs be placed as close as
possible to the output connector, with the analog output traces
being as short as possible (less than 3 inches). The DAC termi-
nation resistors should be placed as close as possible to the DAC
outputs and should overlay the PCB’s ground plane. As well as
minimizing reflections, short analog output traces reduce noise
pickup from neighboring digital circuitry.
To avoid crosstalk between the DAC outputs, it is recommended
that as much space as possible is left between the tracks of the
individual DAC output pins. The addition of ground tracks
between outputs is also recommended.
Supply Decoupling
Noise on the analog power plane can be further reduced by the
use of decoupling capacitors.
Optimum performance is achieved by the use of 10 nF and
0.1 μF ceramic capacitors. Each group of V
AA
, V
DD
, or V
DD_IO
pins should be individually decoupled to ground. This should
be done by placing the capacitors as close as possible to the
device with the capacitor leads as short as possible, thus
minimizing lead inductance.
A 1 μF tantalum capacitor is recommended across the V
AA
supply in addition to 10 nF ceramic. See the circuit layout in
Figure 90.
Digital Signal Interconnect
The digital signal lines should be isolated as much as possible
from the analog outputs and other analog circuitry. Digital
signal lines should not overlay the analog power plane.
Due to the high clock rates, avoid long clock lines to the
ADV7324 to minimize noise pickup.
Any active pull-up termination resistors for the digital inputs
should be connected to the digital power plane, not the analog
power plane.
Analog Signal Interconnect
Locate the ADV7324 as close as possible to the output
connectors to minimize noise pickup and reflections due to
impedance mismatch.
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