參數(shù)資料
型號： AD9549A/PCBZ
廠商： Analog Devices Inc
文件頁數(shù)： 36/76頁
文件大小： 0K
描述： BOARD EVALUATION FOR AD9549A
設計資源： AD9549 Schematics
AD9549 Gerber Files
標準包裝： 1
主要目的： 計時，時鐘發(fā)生器
嵌入式： 否
已用 IC / 零件： AD9549A
主要屬性： 8 kHz ~ 750 MHz 輸入
次要屬性： 差分輸出
已供物品： 板
AD9549
Rev. D | Page 41 of 76
THERMAL PERFORMANCE
Table 9. Thermal Parameters
Symbol
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Value
Unit
θ
JA
Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)
25.2
°C/W
θ
JMA
Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)
22.0
°C/W
θ
JMA
Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)
19.8
°C/W
θ
JB
Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)
13.9
°C/W
θ
JC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
1.7
°C/W
Ψ
JT
Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)
0.1
°C/W
The AD9549 is specified for a case temperature (TCASE). To ensure
that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera-
ture on the application PCB:
TJ = TCASE + (ΨJT × PD)
where:
TJ is the junction temperature (°C).
TCASE is the case temperature (°C) measured by customer at top
center of package.
ΨJT is the value from Table 9.
PD is the power dissipation (see the Total Power Dissipation
parameter in the Specifications section).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ = TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
The values in Table 9 apply to both 64-lead package options.
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