參數(shù)資料
型號(hào)： XC3S200A-4VQ100I
廠商： Xilinx Inc
文件頁(yè)數(shù)： 94/132頁(yè)
文件大?。?/td> 0K
描述： IC FPGA SPARTAN 3 100VQFP
標(biāo)準(zhǔn)包裝： 90
系列： Spartan®-3A
LAB/CLB數(shù)： 448
邏輯元件/單元數(shù)： 4032
RAM 位總計(jì)： 294912
輸入/輸出數(shù)： 68
門數(shù)： 200000
電源電壓： 1.14 V ~ 1.26 V
安裝類型： 表面貼裝
工作溫度： -40°C ~ 100°C
封裝/外殼： 100-TQFP
供應(yīng)商設(shè)備封裝： 100-VQFP（14x14）
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DC and Switching Characteristics
64
DS529-3 (v2.0) August 19, 2010
Revision History
The following table shows the revision history for this document.
Date
Version
Revision
12/05/06
1.0
Initial release.
02/02/07
1.1
Promoted to Preliminary status. Moved Table 15 to under "DC Electrical Characteristics" section. Updated all
timing specifications for the v1.32 speed files. Added recommended Simultaneous Switching Output (SSO)
limits in Table 29. Set a 10 s maximum pulse width for the DNA_PORT READ signal and the JTAG clock
input during the ISC_DNA command, affecting both Table 43 and Table 56. Described "External Termination
Requirements for Differential I/O." Added separate DIN hold time for Slave mode in Table 50. Corrected
wording in Table 52 and Table 54; no specifications affected.
03/16/07
1.2
Updated all AC timing specifications to the v1.34 speeds file. Promoted the XC3S700A and XC3S1400A
FPGAs offered in the -4 speed grade to Production status, as shown in Table 16. Added Note 2 to Table 39
regarding the extra logic (one LUT) automatically added by ISE 9.1i and later software revisions for any DCM
application that leverages the Digital Frequency Synthesizer (DFS). Separated some JTAG specifications by
array size or function, as shown in Table 56. Updated quiescent current limits in Table 10.
04/23/07
1.3
Updated all AC timing specifications to the v1.35 speeds file. Promoted all devices except the XC3S400A to
Production status, as shown in Table 16.
05/08/07
1.4
Updated XC3S400A to Production and v1.36 speeds file. Added banking rules and other explanatory
footnotes to Table 12 and Table 13. Corrected DIFF_SSTL3_II VOL Max in Table 14. Improved XC3S400A
Pin-to-Pin Clock-to-Output times in Table 18. Updated XC3S400A Pin-to-Pin Setup Times in Table 19.
Updated TIOICKPD for -5 in Table 20. Added SSO numbers to Table 28 and Table 29. Removed invalid
Embedded Multiplier Hold Times in Table 34. Improved CLKOUT_FREQ_CLK90 in Table 37. Improved
TTDITCK and FTCK performance for XC3S400A in Table 56.
07/10/07
1.5
Added DIFF_HSTL_I and DIFF_HSTL_III to Table 13, Table 14, Table 27, and Table 29. Updated TMDS DC
characteristics in Table 14. Updated for speed file v1.37 in ISE 9.2.01i as shown in Table 17. Updated
pin-to-pin setup and hold times in Table 19. Updated TMDS output adjustment in Table 26. Updated I/O Test
Method values in Table 27. Added BLVDS SSO numbers inTable 29. For Multiplier block, updated setup times
and added hold times to Table 34. Updated block RAM clock width in Table 35. Updated
CLKOUT_PER_JITT_2X and CLKOUT_PER_JITT_DV2 in Table 37. Added CCLK specifications for
Commercial in Table 46 through Table 48.
04/15/08
1.6
Added VIN to Recommended Operating Conditions in Table 8 and added reference to XAPP459, “Eliminating
I/O Coupling Effects when Interfacing Large-Swing Single-Ended Signals to User I/O Pins.” Reduced typical
ICCINTQ and ICCAUXQ quiescent current values by 12%-58% in Table 10. Increased VIL max to 0.4V for
LVCMOS12/15/18 and improved VIH min to 0.7V for LVCMOS12 in Table 11. Changed VOL max to 0.4V and
VOH min to VCCO-0.4V for LVCMOS15/18 in Table 12. Noted latest speed file v1.39 in ISE 10.1 software in
Table 16. Added new packages to SSO limits in Table 28 and Table 29. Improved SSTL18_II SSO limit for
FG packages in Table 29. Improved FBUFG for -4 to 334 MHz in Table 33. Added references to 375 MHz
performance via SCD 4103 in Table 33,Table 38, Table 39, and Table 40. Restored Units column to Table 44.
Updated CCLK output maximum period in Table 46 to match minimum frequency in Table 47. Corrected BPI
active clock edge in Figure 15 and Table 54.
05/28/08
1.7
Improved VCCAUXT and VCCO2T POR minimum in Table 5 and updated VCCO POR levels in Figure 11.
Clarified recommended VIN in Table 8. Added reference to VCCAUX in "Simultaneously Switching Output
Guidelines". Added reference to Sample Window in Table 21. Removed DNA_RETENTION limit of 10 years
in Table 15 since number of Read cycles is the only unique limit. Added references to UG332.
03/06/09
1.8
Changed typical quiescent current temperature from ambient to junction. Updated BPI configuration
waveforms in Figure 15 and updated Table 55. Updated selected I/O standard DC characteristics. Added
TIOPI and TIOPID in Table 22.
Removed references to SCD 4103.
08/19/10
2.0
Added IIK to Table 4. Updated VIN in Table 8 and footnoted IL in Table 9 to note potential leakage between
pins of a differential pair. Clarified LVPECL notes to Table 13. Corrected symbols for TSUSPEND_GTS and
TSUSPEND_GWE in Table 44.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC3S200A-4VQG100C 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S200A-4VQG100I 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28）
XC3S200A-5FG320C 功能描述:IC SPARTAN-3A FPGA 200K 320FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S200A-5FGG320C 功能描述:IC SPARTAN-3A FPGA 200K 320-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC3S200A-5FT256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
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