參數(shù)資料
型號: XC3S200A-4VQ100I
廠商: Xilinx Inc
文件頁數(shù): 37/132頁
文件大?。?/td> 0K
描述: IC FPGA SPARTAN 3 100VQFP
標(biāo)準(zhǔn)包裝: 90
系列: Spartan®-3A
LAB/CLB數(shù): 448
邏輯元件/單元數(shù): 4032
RAM 位總計: 294912
輸入/輸出數(shù): 68
門數(shù): 200000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 100-TQFP
供應(yīng)商設(shè)備封裝: 100-VQFP(14x14)
Pinout Descriptions
DS529-4 (v2.0) August 19, 2010
131
Revision History
The following table shows the revision history for this document.
Date
Version
Revision
12/05/06
1.0
Initial release.
02/02/07
1.1
Promoted to Preliminary status. Added DOUT pin to DUAL-type pins in Table 57. Corrected counts for
DUAL pins and differential pairs in Table 59. Corrected minor typographical error on pin names for pin
numbers P24 and P25 in Table 66. Highlighted the differences in differential I/O pairs between the
XC3S50A and XC3S200A in the FT256 package, shown in Table 68 and added Table 74 and Table 75
to summarize the differences.
03/16/07
1.2
Corrected minor typographical error in Figure 19.
04/23/07
1.3
Added reference to compatible Spartan-3A DSP family.
05/08/07
1.4
Added note regarding banking rules.
07/10/07
1.5
Updated Thermal Characteristics in Table 62.
04/15/08
1.6
Added VQ100 for XC3S50A and XC3S200A and added FT256 for XC3S700A and XCS1400A to
Table 58, Table 59, and Table 62. Updated Thermal Characteristics with latest data in Table 62.
Corrected bank for T8 and type for U16 in Table 86. Removed VREF name on 6 unconnected N.C. pins
for XC3S1400A FG676 in Table 87 and Figure 27. These pins are noted as VREF if migrating up to the
XC3SD1800A in Table 89.
05/28/08
1.7
Added "Package Overview" section.
03/06/09
1.8
Corrected bank designation for SUSPEND to VCCAUX. Corrected bank designation for JTAG pins in
XC3S700A and XC3S1400A FT256 to VCCAUX.
08/19/10
2.0
Corrected pin 36 number in Figure 17 and Figure 18. Noted difference in FT256 P10/T10 function
between XC3S50A and larger devices in Table 68 and Table 74.
相關(guān)PDF資料
PDF描述
XC3S100E-4TQ144I IC FPGA SPARTAN 3E 144TQFP
XC3S100E-5TQG144C IC FPGA SPARTAN-3E 100K 144-TQFP
XC3S100E-5CPG132C IC FPGA SPARTAN-3E 100K 132CSBGA
XC3S100E-4CPG132I IC FPGA SPARTAN-3E 100K 132CSBGA
24LC16B-E/ST IC EEPROM 16KBIT 400KHZ 8TSSOP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC3S200A-4VQG100C 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC3S200A-4VQG100I 功能描述:IC FPGA SPARTAN-3A 200K 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP(28x28)
XC3S200A-5FG320C 功能描述:IC SPARTAN-3A FPGA 200K 320FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC3S200A-5FGG320C 功能描述:IC SPARTAN-3A FPGA 200K 320-FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)
XC3S200A-5FT256C 功能描述:IC SPARTAN-3A FPGA 200K 256FTBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:Spartan®-3A 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計:2138112 輸入/輸出數(shù):358 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA(27x27)