參數(shù)資料
型號: XC3S200A-4VQ100I
廠商: Xilinx Inc
文件頁數(shù): 69/132頁
文件大小: 0K
描述: IC FPGA SPARTAN 3 100VQFP
標準包裝: 90
系列: Spartan®-3A
LAB/CLB數(shù): 448
邏輯元件/單元數(shù): 4032
RAM 位總計: 294912
輸入/輸出數(shù): 68
門數(shù): 200000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 100-TQFP
供應(yīng)商設(shè)備封裝: 100-VQFP(14x14)
DC and Switching Characteristics
DS529-3 (v2.0) August 19, 2010
41
Differential Standards (Number of I/O Pairs or Channels)
LVDS_25
8
–22
LVDS_33
8
–27
BLVDS_25
1
4
MINI_LVDS_25
8
–22
MINI_LVDS_33
8
–27
LVPECL_25
Input Only
LVPECL_33
Input Only
RSDS_25
8
–22
RSDS_33
8
–27
TMDS_33
8
–27
PPDS_25
8
–22
PPDS_33
8
–27
DIFF_HSTL_I
–5
–10
DIFF_HSTL_III
–3
–4
DIFF_HSTL_I_18
6
8
DIFF_HSTL_II_18
–2
DIFF_HSTL_III_18
4
5
4
DIFF_SSTL18_I
3
6
3
7
DIFF_SSTL18_II
–4
DIFF_SSTL2_I
5
9
DIFF_SSTL2_II
–3
–4
DIFF_SSTL3_I
3
4
5
DIFF_SSTL3_II
2
3
Notes:
1.
Not all I/O standards are supported on all I/O banks. The left and
right banks (I/O banks 1 and 3) support higher output drive
current than the top and bottom banks (I/O banks 0 and 2).
Similarly, true differential output standards, such as LVDS,
RSDS, PPDS, miniLVDS, and TMDS, are only supported in top
or bottom banks (I/O banks 0 and 2). Refer to UG331: Spartan-3
Generation FPGA User Guide for additional information.
2.
The numbers in this table are recommendations that assume
sound board lay out practice. Test limits are the VIL/VIH voltage
limits for the respective I/O standard.
3.
If more than one signal standard is assigned to the I/Os of a given
bank, refer to XAPP689: Managing Ground Bounce in Large
FPGAs for information on how to perform weighted average SSO
calculations.
Table 29: Recommended Number of Simultaneously Switching
Outputs per VCCO-GND Pair (VCCAUX=3.3V)(Continued)
Signal Standard
(IOSTANDARD)
Package Type
VQ100, TQ144
FT256, FG320,
FG400, FG484,
FG676
Top,
Bottom
(Banks
0,2)
Left,
Right
(Banks
1,3)
Top,
Bottom
(Banks
0,2)
Left,
Right
(Banks
1,3)
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