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參數(shù)資料
| 型號： | W25Q80VZPIG |
| 廠商： | WINBOND ELECTRONICS CORP |
| 元件分類： | PROM |
| 英文描述： | 1M X 8 SPI BUS SERIAL EEPROM, DSO8 |
| 封裝： | 6 X 5 MM, GREEN, WSON-8 |
| 文件頁數(shù)： | 36/61頁 |
| 文件大?。?/td> | 1794K |
| 代理商： | W25Q80VZPIG |
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W25Q80, W25Q16, W25Q32
Publication Release Date: September 26, 2007
- 41 -
Preliminary - Revision B
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in figure 25, except that after /CS is driven high it must
remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will
resume normal operation and other instructions will be accepted. If the Release from Power-down /
Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY
equals 1) the instruction is ignored and will not have any effects on the current cycle
Figure 24. Release Power-down/High Performance Mode Instruction Sequence
Figure 25. Release Power-down / Device ID Instruction Sequence Diagram
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| W25X16AVDAIZ | 2M X 8 FLASH 2.7V PROM, PDIP8 |
| W25X40AVSSIG | 512K X 8 FLASH 2.7V PROM, PDSO8 |
| W25X80AVDAIZ | 1M X 8 FLASH 2.7V PROM, PDIP8 |
| W25X80ALSSIG | 1M X 8 FLASH 2.7V PROM, PDSO8 |
| W25X40ALDAIZ | 512K X 8 FLASH 2.7V PROM, PDIP8 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| W25S243A | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
| W25S243A-12 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
| W25S243AD-12 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
| W25S243AF-12 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:64K X 64 BURST PIPELINED HIGH-SPEED CMOS STATIC RAM |
| W25X10 | 制造商:WINBOND 制造商全稱:Winbond 功能描述:The W25X10 (1M-bit), W25X20 (2M-bit), W25X40 (4M-bit) and W25X80 (8M-bit) Serial Flash memories provide a storage solution for systems with limited space, pins and power. |
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