參數(shù)資料
型號(hào): SST89C58-33-I-TQJE
廠商: SILICON STORAGE TECHNOLOGY INC
元件分類: 微控制器/微處理器
英文描述: 8-BIT, FLASH, 33 MHz, MICROCONTROLLER, PQFP44
封裝: LEAD FREE, TQFP-44
文件頁(yè)數(shù): 29/52頁(yè)
文件大?。?/td> 967K
代理商: SST89C58-33-I-TQJE
Data Sheet
FlashFlex51 MCU
SST89C54 / SST89C58
35
2004 Silicon Storage Technology, Inc.
S71131-04-000
6/04
FIGURE
11-1: OSCILLATOR CHARACTERISTICS
12.0 ELECTRICAL SPECIFICATION
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute Maximum
Stress Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation
of the device at these conditions or conditions greater than those defined in the operational sections of this data
sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.)
Ambient Temperature Under Bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65°C to + 150°C
Voltage on EA# Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +14.0V
Transient Voltage (<20ns) on Any Other Pin to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1.0V to +6.5V
Maximum IOL per I/O Pins P1.5, P1.6, P1.7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20mA
Maximum IOL per I/O for All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15mA
Package Power Dissipation Capability (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5W
Through Hole Lead Soldering Temperature (10 Seconds). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300°C
Surface Mount Lead Soldering Temperature (3 Seconds) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240°C
Output Short Circuit Current1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
1. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.)
This specification contains preliminary information on new products in production.
The specifications are subject to change without notice.
TABLE
12-1: OPERATING RANGE
Symbol
Description
Min.
Max
Unit
Ta
Ambient Temperature Under Bias
Standard
0
+70
°C
Industrial
-40
+85
°C
VDD
Supply Voltage
2.7
5.5
V
fOSC
Oscillator Frequency
For in-application programming
033
MHz
0.25
33
MHz
T12-1.0 1131
1131 F19.0
XTAL2
XTAL1
Vss
C1
Using the On-Chip Oscillator
External Clock Drive
C2
XTAL2
XTAL1
Vss
EXTERNAL
OSCILLATOR
SIGNAL
NC
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