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參數資料
| 型號： | NT5TU64M16DG-3C |
| 廠商： | NANYA TECHNOLOGY CORP |
| 元件分類： | DRAM |
| 英文描述： | 64M X 16 DDR DRAM, 0.45 ns, PBGA84 |
| 封裝： | GREEN, BGA-84 |
| 文件頁數： | 42/85頁 |
| 文件大?。?/td> | 2622K |
| 代理商： | NT5TU64M16DG-3C |
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NT5TU256M4GE / NT5TU128M8GE / NT5TU64M16GG
1Gb DDR2 SDRAM
47
REV 1.0
06 / 2010
Self-Refresh Command
The Self-Refresh command can be used to retain data, even if the rest of the system is powered down. When in the
Self-Refresh mode, the DDR2 SDRAM retains data without external clocking.
The DDR2 SDRAM device has a built-in timer to accommodate Self-Refresh operation. The Self-Refresh Command is
defined by having
, , and held low with high at the rising edge of the clock. ODT must be turned off
before issuing Self Refresh command, by either driving ODT pin low or using EMRS (1) command. Once the command is
registered, CKE must be held low to keep the device in Self-Refresh mode. When the DDR2 SDRAM has entered
Self-Refresh mode all of the external control signals, except CKE, are disabled. The clock is internally disabled during
Self-Refresh Operation to save power. The user may change the external clock frequency or halt the external clock one
clock after Self-Refresh entry is registered, however, the clock must be restarted and stable before the device can exit
Self-Refresh operation. Once Self-Refresh Exit command is registered, a delay equal or longer than the tXSNR or tXSRD must
be satisfied before a valid command can be issued to the device. CKE must remain high for the entire Self-Refresh exit
period (tXSNR or tXSRD) for proper operation. NOP or DESELECT commands must be registered on each positive clock edge
during the Self-Refresh exit interval. Since the ODT function is not supported during Self-Refresh operation, ODT has to be
turned off tAOFD before entering Self-Refresh Mode and can be turned on again when the tXSRD timing is satisfied.
CK/CK
T1
T3
T2
CK/CK may
be halted
CK/CK must
be stable
CKE
>=tXSRD
>= tXSNR
Tn
Tr
Tm
T5
T4
tRP*
tis
tAOFD
CMD
Self Refresh
Entry
NOP
Non-Read
Command
Read
Command
T0
tis
ODT
* Device must be in theing "All banks idle" state to enter Self Refresh mode.
* ODT must be turned off prior to entering Self Refresh mode.
* tXSRD (>=200 tCK) has to be satisfied for a Read or as Read with Auto-Precharge commend.
* tXSNR has to be satisfied for any command execept Read or a Read with Auto-Precharge command, where tXSNR is defined as tRFC + 10ns.
* The minium CKE low time is defined by the tCKEmin. timming paramester.
* Since CKE is an SSTL input, VREF must maintained during Self-Refresh.
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| NTA2410-10 | |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| NT5TU64M16GG-AC | 制造商:Nanya Technology Corporation 功能描述:DRAM |
| NT5TU64M16GG-ACI | 制造商:Nanya Technology Corporation 功能描述:DRAM |
| NT5TU64M16HG-AC | 制造商:Nanya Technology Corporation 功能描述:MEMORY IC |
| NT5TU64M16HG-BE | 制造商:Nanya Technology Corporation 功能描述:MEMORY IC |
| NT6 | 功能描述:烙鐵 Weller Chisel Tip For WMP Solder Penc RoHS:否 制造商:Weller 產品:Soldering Stations 類型:Digital, Iron, Stand, Cleaner 瓦特:50 W 最大溫度:+ 850 F 電纜類型:US Cord Included |
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