參數(shù)資料
型號： NAND512R3M0BZBE
廠商： STMICROELECTRONICS
元件分類： 存儲器
英文描述： SPECIALTY MEMORY CIRCUIT, PBGA107
封裝： 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TFBGA-107
文件頁數(shù)： 13/22頁
文件大?。?/td> 200K
代理商： NAND512R3M0BZBE
Part Numbering
NAND256-M, NAND512-M, NAND01G-M
20/22
4
Part Numbering
Devices are shipped from the factory with the Flash memory content bits, in valid blocks,
erased to ’1’. For further information on any aspect of this device, please contact your
nearest ST Sales Office.
Table 9.
Ordering Information Scheme
Example:
NAND256
R
3
M
4
A
ZB
5
E
Device Type
NAND Flash Memory
NAND Flash Density
256 = 256Mb
512 = 512Mb
01G = 1Gb
Operating Voltage
R = VDDF = 1.7V to 1.95V
W = VDDF = 2.5V to 3.6V
NAND Bus Width
3 = x8
4 = x16
Family Identifier
M = 528 Byte Page NAND Flash + LPSDRAM
Device Options
0 = 256, x16, 104MHz, SDR, BGA107
2 = 2 x 256, 2x16, 104MHz, SDR, BGA137
3 = 256, x16, 133MHz, DDR BGA149
4 = 256, x16, 104MHz, SDR, BGA149
5 = 512, x16, 133MHz, DDR, BGA149
Product Version
A
B
C
Package
ZB = TFBGA
ZC = LFBGA
Temperature range
5 = -30°c to 85°C
Option
E = ECOPACK Package, Standard Packing
F = ECOPACK Package, Tape & Reel Packing
相關(guān)PDF資料
PDF描述
NAND512W3A2SN6E 64M X 8 FLASH 3V PROM, PDSO48
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相關(guān)代理商/技術(shù)參數(shù)
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NAND512R4A2DDI6 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film
NAND512W3A0AN6 功能描述:閃存 NAND & S.MEDIA FLASH RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
NAND512W3A0AN6E 功能描述:閃存 2.7-3.6V 512M(64Mx8) RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲類型:Flash 存儲容量:2 MB 結(jié)構(gòu):256 K x 8 定時類型: 接口類型:SPI 訪問時間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
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