參數(shù)資料
型號: NAND02GW4B2AN1T
廠商: NUMONYX
元件分類: PROM
英文描述: 128M X 16 FLASH 3V PROM, 35 ns, PDSO48
封裝: 12 X 20 MM, PLASTIC, TSOP-48
文件頁數(shù): 41/57頁
文件大小: 887K
代理商: NAND02GW4B2AN1T
NAND01G-B, NAND02G-B, NAND04G-B, NAND08G-B
46/57
Figure 28. Read Status Register AC Waveform
Figure 29. Read Electronic Signature AC Waveform
Note: 1. Refer to Table 14. for the values of the Manufacturer and Device Codes, and to Table 15. for the information contained in Byte4.
tELWL
tDVWH
Status Register
Output
70h/ 72h/
73h/ 74h/ 75h
CL
E
W
R
I/O
tCLHWL
tWHDX
tWLWH
tWHCLL
tCLLRL
tDZRL
tRLQV
tEHQZ
tRHQZ
tWHRL
tELQV
tWHEH
ai08666
(Data Setup time)
(Data Hold time)
90h
00h
Man.
code
Device
code
CL
E
W
AL
R
I/O
tRLQV
Read Electronic
Signature
Command
1st Cycle
Address
ai08667
(Read ES Access time)
tALLRL1
00h
Byte4
Byte3
Byte1
Byte2
see Note.1
相關PDF資料
PDF描述
NAND04GR4B2CN1F 256M X 16 FLASH 1.8V PROM, 35 ns, PDSO48
NAND08GW3B2CZL1F 1G X 8 FLASH 3V PROM, 25000 ns, PBGA52
NAND128W3A2BV6E 16M X 8 FLASH 3V PROM, 12000 ns, PDSO48
NAND512R3A2CV6E 64M X 8 FLASH 1.8V PROM, 15000 ns, PDSO48
NAND128W4A2CZA6E 8M X 16 FLASH 3V PROM, 35 ns, PBGA55
相關代理商/技術參數(shù)
參數(shù)描述
NAND04GR3B2DDI6 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film
NAND04GR3B2DN6E 功能描述:IC FLASH 4GBIT 48TSOP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M(64M x 8) 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應商設備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040
NAND04GR3B2DZL6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel
NAND04GR3B2EN6E 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND04GR3B2EN6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel