參數(shù)資料
型號: BX805573060
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 64-BIT, 2400 MHz, MICROPROCESSOR, CBGA775
封裝: LGA-775
文件頁數(shù): 99/102頁
文件大小: 2428K
代理商: BX805573060
Boxed Processor Specifications
96
Dual-Core Intel Xeon Processor 3000 Series Datasheet
The boxed processor's fanheat sink requires a constant +12 V supplied to pin 2 and
does not support variable voltage control or 3-pin PWM control.
The power header on the baseboard must be positioned to allow the fan heatsink power
cable to reach it. The power header identification and location should be documented in
the platform documentation, or on the system board itself. Figure 7-6 shows the
location of the fan power connector relative to the processor socket. The baseboard
power header should be positioned within 110 mm [4.33 inches] from the center of the
processor socket.
Figure 7-5. Boxed Processor Fan Heatsink Power Cable Connector Description
Table 7-1.
Fan Heatsink Power and Signal Specifications
Description
Min
Typ
Max
Unit
Notes
+12 V: 12 volt fan power supply
11.4
12
12.6
V
-
IC:
Peak fan steady-state current draw
Average fan steady-state current draw
Max fan start-up current draw
Fan start-up current draw maximum duration
3.0
2.0
3.0
1.0
A
Second
-
SENSE: SENSE frequency
2
pulses per fan
revolution
1
Notes:
1. Baseboard should pull this pin up to 5 V with a resistor.
CONTROL
21
25
28
Hz
2, 3
2. Open drain type, pulse width modulated.
3. The fan will have a pull-up resistor for this signal, maximum of 5.25 V.
C
Pin
Signal
12 34
1
2
3
4
GND
+12 V
SENSE
CONTROL
Straight square pin, 4-pin terminal housing with
polarizing ribs and friction locking ramp.
0.100" pitch, 0.025" square pin width.
Match with straight pin, friction lock header on
mainboard.
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