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參數(shù)資料
| 型號： | BX805573060 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 2400 MHz, MICROPROCESSOR, CBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 97/102頁 |
| 文件大小： | 2428K |
| 代理商： | BX805573060 |
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Boxed Processor Specifications
94
Dual-Core Intel Xeon Processor 3000 Series Datasheet
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed processor. The
boxed processor will be shipped with an unattached fan heatsink. Figure 7-1 shows a
mechanical representation of the boxed processor.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper
cooling. The physical space requirements and dimensions for the boxed processor with
assembled fan heatsink are shown in Figure 7-2 (Side View), and Figure 7-3 (Top
View). The airspace requirements for the boxed processor fan heatsink must also be
incorporated into new baseboard and system designs. Airspace requirements are
shown in Figure 7-7 and Figure 7-8. Note that some figures have centerlines shown
(marked with alphabetic designations) to clarify relative dimensioning.
Notes:
1.
Diagram does not show the attached hardware for the clip design and is provided only as a mechanical
representation.
Figure 7-2. Space Requirements for the Boxed Processor (Side View)
Figure 7-3. Space Requirements for the Boxed Processor (Top View)
95.0
[3.74]
10.0
[0.39]
25.0
[0.98]
81.3
[3.2]
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