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參數(shù)資料
| 型號： | BX805573060 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 2400 MHz, MICROPROCESSOR, CBGA775 |
| 封裝： | LGA-775 |
| 文件頁數(shù)： | 75/102頁 |
| 文件大小： | 2428K |
| 代理商： | BX805573060 |
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Thermal Specifications and Design Considerations
74
Dual-Core Intel Xeon Processor 3000 Series Datasheet
temperature and voltage conditions. Refer to the Dual-Core Intel Xeon Processor
3000 Series Thermal and Mechanical Design Guidelines and the Processor Power
Characterization Methodology for the details of this methodology.
The case temperature is defined at the geometric top center of the processor. Analysis
indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that
complete thermal solution designs target the Thermal Design Power (TDP) indicated in
Table 5-1 instead of the maximum processor power consumption. The Thermal Monitor
feature is designed to protect the processor in the unlikely event that an application
exceeds the TDP recommendation for a sustained periods of time. For more details on
the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor and
Thermal Monitor 2 feature must be enabled for the processor to remain within
specification.
Table 5-1.
Processor Thermal Specifications
Processor
Number
Core
Frequency
(GHz)
Thermal
Design
Power (W)
Extended
HALT
Power (w)1
Notes:
1. Specification is at 50 °C TC and typical voltage loadline.
775_VR_
CONFIG_06
Guidance2
2. 775_VR_CONFIG_06 guidelines provide a design target for meeting future thermal requirements.
Minimum TC
(°C)
Maximum TC
(°C)
Notes
3070
2.66
65.0
20.0
775_VR_CONFIG_0
6
5See Table 5-2,
3, 4
3. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.
4. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for
the allowed combinations of power and TC.
3060
2.40
65.0
22.0
5
3050
2.13
65.0
22.0
5
See Table 5-3,
and Table 5-2
3040
1.86
65.0
22.0
5
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