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參數資料

型號：	BX805573060
廠商：	INTEL CORP
元件分類：	微控制器/微處理器
英文描述：	64-BIT, 2400 MHz, MICROPROCESSOR, CBGA775
封裝：	LGA-775
文件頁數：	26/102頁
文件大?。?/td>	2428K
代理商：	BX805573060

Dual-Core Intel Xeon Processor 3000 Series Datasheet

Contents

1Introduction ............................................................................................................ 11

1.1

Terminology ..................................................................................................... 11

1.1.1

Processor Terminology ............................................................................ 12

1.2

References ....................................................................................................... 13

Electrical Specifications ........................................................................................... 15

2.1

Power and Ground Lands.................................................................................... 15

2.2

Decoupling Guidelines........................................................................................ 15

2.2.1

VCC Decoupling ..................................................................................... 15

2.2.2

Vtt Decoupling ....................................................................................... 15

2.2.3

FSB Decoupling...................................................................................... 16

2.3

Voltage Identification ......................................................................................... 16

2.4

Market Segment Identification (MSID) ................................................................. 18

2.5

Reserved, Unused, and TESTHI Signals ................................................................ 18

2.6

Voltage and Current Specification ........................................................................ 19

2.6.1

Absolute Maximum and Minimum Ratings .................................................. 19

2.6.2

DC Voltage and Current Specification ........................................................ 20

2.6.3

VCC Overshoot ....................................................................................... 24

2.6.4

Die Voltage Validation ............................................................................. 24

2.7

Signaling Specifications...................................................................................... 25

2.7.1

FSB Signal Groups.................................................................................. 25

2.7.2

CMOS and Open Drain Signals ................................................................. 27

2.7.3

Processor DC Specifications ..................................................................... 27

2.7.3.1

GTL+ Front Side Bus Specifications ............................................. 29

2.7.4

Clock Specifications ................................................................................ 29

2.7.5

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 29

2.7.6

FSB Frequency Select Signals (BSEL[2:0])................................................. 30

2.7.7

Phase Lock Loop (PLL) and Filter .............................................................. 30

2.7.8

BCLK[1:0] Specifications (CK505 based Platforms) ..................................... 30

2.7.9

BCLK[1:0] Specifications (CK410 based Platforms) ..................................... 32

Package Mechanical Specifications .......................................................................... 33

3.1

Package Mechanical Drawing............................................................................... 34

3.1.1

Processor Component Keep-Out Zones...................................................... 38

3.1.2

Package Loading Specifications ................................................................ 38

3.1.3

Package Handling Guidelines.................................................................... 38

3.1.4

Package Insertion Specifications............................................................... 38

3.1.5

Processor Mass Specification.................................................................... 39

3.1.6

Processor Materials................................................................................. 39

3.1.7

Processor Markings................................................................................. 39

3.1.8

Processor Land Coordinates ..................................................................... 40

Land Listing and Signal Descriptions ....................................................................... 43

4.1

Processor Land Assignments ............................................................................... 43

4.2

Alphabetical Signals Reference ............................................................................ 66

Thermal Specifications and Design Considerations .................................................. 73

5.1

Processor Thermal Specifications ......................................................................... 73

5.1.1

Thermal Specifications ............................................................................ 73

5.1.2

Thermal Metrology ................................................................................. 77

5.2

Processor Thermal Features ................................................................................ 77

5.2.1

Thermal Monitor..................................................................................... 77

5.2.2

Thermal Monitor 2 .................................................................................. 78

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