參數(shù)資料
型號: W25Q64CVSSAG
廠商: WINBOND ELECTRONICS CORP
元件分類: PROM
英文描述: 64M X 1 SPI BUS SERIAL EEPROM, PDSO8
封裝: 0.208 INCH, GREEN, SOIC-8
文件頁數(shù): 13/79頁
文件大?。?/td> 1086K
代理商: W25Q64CVSSAG
W25Q64CV
- 20 -
7.2.2
Instruction Set Table 1 (Erase, Program Instructions)(1)
INSTRUCTION NAME
BYTE 1
(CODE)
BYTE 2
BYTE 3
BYTE 4
BYTE 5
BYTE 6
Write Enable
06h
Write Enable for Volatile
Status Register
50h
Write Disable
04h
Read Status Register-1
05h
(S7–S0)
(2)
Read Status Register-2
35h
(S15-S8)
(2)
Write Status Register
01h
(S7–S0)
(S15-S8)
Page Program
02h
A23–A16
A15–A8
A7–A0
(D7–D0)
Quad Page Program
32h
A23–A16
A15–A8
A7–A0
(D7–D0, …)
(3)
Sector Erase (4KB)
20h
A23–A16
A15–A8
A7–A0
Block Erase (32KB)
52h
A23–A16
A15–A8
A7–A0
Block Erase (64KB)
D8h
A23–A16
A15–A8
A7–A0
Chip Erase
C7h/60h
Erase / Program Suspend
75h
Erase / Program Resume
7Ah
Power-down
B9h
Continuous Read Mode
Reset
(4)
FFh
FFh
Notes:
1.
Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “()” indicate data being
read from the device on the DO pin.
2.
The Status Register contents will repeat continuously until /CS terminates the instruction.
3.
Quad Page Program Input Data:
IO0 = (D4, D0, ……)
IO1 = (D5, D1, ……)
IO2 = (D6, D2, ……)
IO3 = (D7, D3, ……)
4.
This instruction is recommended when using the Dual or Quad “Continuous Read Mode” feature. See section
7.2.19 & 7.2.20 for more information.
相關(guān)PDF資料
PDF描述
WS32K32-100HC 128K X 8 MULTI DEVICE SRAM MODULE, 100 ns, CHIP66
WS128K32-25G4CE 512K X 8 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
WMS128K8L-35DEQE 128K X 8 STANDARD SRAM, 35 ns, CDSO32
WMF512K8X-120CLQ5 512K X 8 FLASH 5V PROM, 120 ns, CQCC32
WF4M16-150DTI5 4M X 16 FLASH 5V PROM MODULE, 150 ns, CDSO56
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
W25Q64CVSSAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVSSIG 功能描述:IC SPI FLASH 64MBIT 8-SOIC RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:SpiFlash® 標(biāo)準(zhǔn)包裝:1,000 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-SOIC(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:8-MFP 包裝:帶卷 (TR)
W25Q64CVSSIP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVTCAG 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q64CVTCAP 制造商:WINBOND 制造商全稱:Winbond 功能描述:3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI