參數(shù)資料
型號(hào)： UPD78053GK-XXX-BE9
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, MICROCONTROLLER, PQFP80
封裝： 12 X 12 MM, FINE PITCH, PLASTIC, TQFP-80
文件頁(yè)數(shù)： 65/78頁(yè)
文件大小： 610K
代理商： UPD78053GK-XXX-BE9
68
PD78052, 78053, 78054, 78055, 78056, 78058
Data Sheet U12327EJ5V0DS00
14. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales represen-
tative.
Table 14-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
PD78052GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
PD78053GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
PD78054GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
PD78055GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
PD78056GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
PD78058GC-×××-8BT: 80-pin plastic QFP (14 × 14 mm)
Soldering
Recommended
Method
Soldering Conditions
Condition Symbol
Infrared reflow
IR35-00-2
VPS
VP15-00-2
Wave soldering
WS60-00-1
Partial Heating
—
Caution Do not use different soldering methods together (except for partial heating).
Package peak temperature: 235
°C, Time: 30 seconds max. (at 210°C or higher),
Count: Twice max.
Package peak temperature: 215
°C, Time: 40 seconds max. (at 200°C or higher),
Count: Twice max.
Solder bath temperature: 260
°C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°C max. (package surface temperature)
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
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