
TMS320F243, TMS320F241
DSP CONTROLLERS
SPRS064B – DECEMBER 1997 – REVISED FEBRUARY 1999
71
POST OFFICE BOX 1443 
 HOUSTON, TEXAS 77251–1443
device and development support tool nomenclature (continued)
Support tool development evolutionary flow:
TMDX
Development support product that has not completed TI’s internal qualification testing
TMDS
Fully qualified development support product
TMX and TMP devices and TMDX development support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development support tools have been fully characterized, and the quality and reliability
of the device have been fully demonstrated. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production
devices. Texas Instruments recommends that these devices not be used in any production system because their
expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type
(for example, PN, PQ, and PZ) and temperature range (for example, L). Figure 16 provides a legend for reading
the complete device name for any TMS320x2xx family member.
PREFIX
TMX =
TMP =
TMS =
TEMPERATURE RANGE (DEFAULT: 0
°
C TO 70
°
C)
L
=
0
°
C to 70
°
C
A =
–40
°
C to 85
°
C
S =
–40
°
C to 125
°
C
Q =
–40
°
C to 125
°
C, Q 100 Fault Grading
PACKAGE TYPE
FN
=
68-pin PLCC
PG =
64-pin plastic QFP
PGE=
144-pin plastic QFP
TMS 320
F 243
PGE (L)
experimental device
prototype device
qualified device
DEVICE FAMILY
320 =
TMS320 Family
TECHNOLOGY
C =
CMOS
E =
CMOS EPROM
F =
Flash EEPROM
LC =
Low-voltage CMOS (3.3 V)
VC=
Low-voltage CMOS (3 V)
DEVICE
’20x DSP
203
206
209
’24x DSP
240
241
242
243
(B)
BOOT-LOADER OPTION
PLCC =
QFP
Plastic J-Leaded Chip Carrier
Quad Flatpack
=
Figure 16. TMS320 Device Nomenclature