參數(shù)資料
型號(hào)： SDED5-008G-NCY
廠商： SANDISK CORP
元件分類(lèi)： 存儲(chǔ)控制器/管理單元
英文描述： FLASH MEMORY DRIVE CONTROLLER, PBGA115
封裝： 12 X 18 MM, 1.40 MM HEIGHT, FBGA-115
文件頁(yè)數(shù)： 26/87頁(yè)
文件大?。?/td> 1675K
代理商： SDED5-008G-NCY
Rev. 1.2
mDOC H3 Modes of Operation
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
32
92-DS-1205-10
The above power modes are separated into two main groups:
Work mode group – in which the device is active and performs various transactions.
Idle mode group – in which the device is not active.
The power mode is determined as follows:
Assertion of the RSTIN# signal sets the device in Reset state.
Upon power up the device enters its pre-configured work mode.
Default work mode is Turbo mode. The default can be changed to PowerSave mode
and vice-versa using S/W API.
Once in any idle mode the device will move to work mode upon any transaction. It
may return to idle mode upon inactivity, if so configured.
Entry and exit to/from Deep Power-Down mode is described below.
5.1
Reset State
While in Reset State, mDOC H3 ignores all write transactions and returns undefined values in
response to any read access.
5.2
Turbo Mode
This mode is defined as a "work mode" and is optimized for performance. All internal clocks are
set to maximal work frequency.
In this mode all standard operations involving the flash memory can be performed.
5.3
Power Save Mode
This mode is defined as a "work mode" and is optimized for balance between power
consumption and performance. Balance is achieved by setting internal clocks to predefined
optimal settings.
In this mode all standard operations involving the flash memory can be performed.
5.4
Standby Mode
mDOC H3 enters standby mode upon device inactivity. In Standby mode the clock of most
internal cores is either disconnected or reduced to a minimum. There is no wake-up time penalty
when switching back to working mode.
相關(guān)PDF資料
PDF描述
MD80C154-12/883 8-BIT, 12 MHz, MICROCONTROLLER, CDIP40
MD80C154-16P883D 8-BIT, 16 MHz, MICROCONTROLLER, CDIP40
MR83C154CXXX-20/883D 8-BIT, MROM, 20 MHz, MICROCONTROLLER, CQCC44
MQ83C154CXXX-L16/883 8-BIT, MROM, 16 MHz, MICROCONTROLLER, CQFP44
MD83C154CXXX-25P883D 8-BIT, MROM, 25 MHz, MICROCONTROLLER, CDIP40
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SDED5-512M-N9T 功能描述:IC MDOC H3 4GB 115-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF)
SDED5-512M-N9Y 功能描述:IC MDOC H3 4GB 115-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF)
SDED7-002G-NTY 制造商:SanDisk Corporation 功能描述:Flash Card 2G-Byte 1.8V/3.3V Flash Disk 115-Pin FBGA Tray
SDED7-256M-N9T 功能描述:IC MDOC H3 2GB 115-FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF)
SDED7-256M-N9Y 功能描述:IC MDOC H3 256MB FBGA RoHS:是 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類(lèi)型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF)
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