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參數(shù)資料
| 型號(hào)： | SDED5-008G-NCY |
| 廠商： | SANDISK CORP |
| 元件分類： | 存儲(chǔ)控制器/管理單元 |
| 英文描述： | FLASH MEMORY DRIVE CONTROLLER, PBGA115 |
| 封裝： | 12 X 18 MM, 1.40 MM HEIGHT, FBGA-115 |
| 文件頁(yè)數(shù)： | 19/87頁(yè) |
| 文件大小： | 1675K |
| 代理商： | SDED5-008G-NCY |
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Rev. 1.2
Theory of Operation
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
26
92-DS-1205-10
Flash IF – Physical interface to the Flash Media.
Power and Timing – Analog and clock circuits to provide power and timing for the
H3 controller and flash.
Embedded CPU – Runs Embedded TrueFFS SW and mDOC H3 controller
firmware.
3.2
Host Interface
3.2.1
Demux (NOR-Like) Interface
The host interface block provides an easy-to-integrate NOR-like (also SRAM and EEPROM-
like) interface to mDOC H3, enabling various CPU interfaces, such as a local bus, ISA bus, NOR
interface, SRAM interface, EEPROM interface or any other compatible interface. In addition, the
NOR-like interface enables direct access to the Programmable Boot Block to permit XIP
(Execute-In-Place) functionality during system initialization.
A1-A16 address lines enable access to the mDOC H3 128KB memory window. When migrating
from mDOC G3/G4/H1 without changing the PCB, thus using only A1-A12 address lines,
mDOC H3 exports 8KB memory window, like in mDOC G3/G4 and H1.
The Chip Enable (CE#), Write Enable (WE#) and Output Enable (OE#) signals trigger read and
write cycles. A write cycle occurs while both the CE# and the WE# inputs are asserted.
Similarly, a read cycle occurs while both the CE# and OE# inputs are asserted. Note that mDOC
H3 does not require a clock signal. The CE#, WE# and OE# signals trigger the controller (e.g.,
system interface block, bus control and data pipeline) and flash access.
The Reset-In (RSTIN#) and Busy (BUSY#) control signals are used in the reset phase.
The Interrupt Request (IRQ#) signal is used to indicate completion of assorted operations. Using
this signal frees the CPU to run other tasks, continuing read/write operations with mDOC H3
only after the IRQ# signal has been asserted and an interrupt handling routine (implemented in
the OS) has been called to return control to the DOC Driver.
The DMARQ# output is used to control DMA operations, and the CLK input is used to support
Burst operation when reading flash data. See Section 10.3 for further information.
3.2.2
Multiplexed Interface
In this configuration, the address and data signals are multiplexed. The AVD# input is driven by
the host AVD# signal, and the D[15:0] signals, used for both address inputs and data, are
connected to the host AD[15:0] bus. While AVD# is asserted, the host drives AD[15:0] with bits
[16:1] of the address.
This interface is automatically used when a falling edge is detected on AVD#. This edge must
occur after RSTIN# is de-asserted and before the first read or write cycle to the controller.
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| MD80C154-16P883D | 8-BIT, 16 MHz, MICROCONTROLLER, CDIP40 |
| MR83C154CXXX-20/883D | 8-BIT, MROM, 20 MHz, MICROCONTROLLER, CQCC44 |
| MQ83C154CXXX-L16/883 | 8-BIT, MROM, 16 MHz, MICROCONTROLLER, CQFP44 |
| MD83C154CXXX-25P883D | 8-BIT, MROM, 25 MHz, MICROCONTROLLER, CDIP40 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SDED5-512M-N9T | 功能描述:IC MDOC H3 4GB 115-FBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF) |
| SDED5-512M-N9Y | 功能描述:IC MDOC H3 4GB 115-FBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF) |
| SDED7-002G-NTY | 制造商:SanDisk Corporation 功能描述:Flash Card 2G-Byte 1.8V/3.3V Flash Disk 115-Pin FBGA Tray |
| SDED7-256M-N9T | 功能描述:IC MDOC H3 2GB 115-FBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF) |
| SDED7-256M-N9Y | 功能描述:IC MDOC H3 256MB FBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:150 系列:- 格式 - 存儲(chǔ)器:EEPROMs - 串行 存儲(chǔ)器類型:EEPROM 存儲(chǔ)容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁(yè)面:1445 (CN2011-ZH PDF) |
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