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| 型號： | PC8245MTPU300D |
| 廠商： | ATMEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | Integrated Processor Family |
| 中文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352 |
| 封裝： | 35 X 35 MM, 1.27 MM PITCH, TBGA-352 |
| 文件頁數(shù)： | 21/61頁 |
| 文件大?。?/td> | 429K |
| 代理商： | PC8245MTPU300D |
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21
PC8245
2171D–HIREL–06/04
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the ther-
mal environment to change the case-to-ambient thermal resistance, R
θ
CA
. For instance,
the user can change the size of the heat sink, the air flow around the device, the inter-
face material, the mounting arrangement on the printed-circuit board, or the thermal
dissipation on the printed-circuit board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks
are not used, the thermal characterization parameter (
θ
JT
) can be used to determine the
junction temperature with a measurement of the temperature at the top center of the
package case using the following equation:
T
J
= T
T
+ (
θ
JT
x P
D
)
where:
T
T
= thermocouple temperature atop the package (
°
C)
θ
JT
= thermal characterization parameter (
°
C/W)
P
D
= power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using
a 40-gauge type T thermocouple epoxied to the top center of the package case. The
thermocouple should be positioned so that the thermocouple junction rests on the pack-
age. A small amount of epoxy is placed over the thermocouple junction and over about 1
mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors caused by cooling effects of the thermocou-
ple wire.
When a heat sink is used, the junction temperature is determined from a thermocouple
inserted at the interface between the case of the package and the interface material. A
clearance slot or hole is normally required in the heat sink. Minimizing the size of the
clearance is important to minimize the change in thermal performance caused by
removing part of the thermal interface to the heat sink. Because of the experimental dif-
ficulties with this technique, many engineers measure the heat sink temperature and
then back calculate the case temperature using a separate measurement of the thermal
resistance of the interface.
From this case temperature, the junction temperature is determined from the junction-to-
case thermal resistance.
In many cases, it is appropriate to simulate the system environment using a computa-
tional fluid dynamics thermal simulation tool. In such a tool, the simplest thermal model
of a package which has demonstrated reasonable accuracy (about 20%) is a two-resis-
tor model consisting of a junction-to-board and a junction-to-case thermal resistance.
The junction-to-case covers the situation where a heat sink will be used or where a sub-
stantial amount of heat is dissipated from the top of the package. The junction-to-board
thermal resistance describes the thermal performance when most of the heat is con-
ducted to the printed-circuit board.
References
Semiconductor Equipment and Materials International
805 East Middlefield Rd.
Mountain View, CA 94043
(415) 964-5111
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering
Documents at 800-854-7179 or 303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| PC8245MTPU333D | 制造商:e2v Aerospace & Defense 功能描述:MPU MPC82xx RISC 32-Bit 0.25um 333MHz 3.3V 352-Pin TBGA 制造商:e2v technologies 功能描述:MPU MPC82XX RISC 32BIT 0.25UM 333MHZ 3.3V 352TBGA - Trays |
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| PC824A | 功能描述:PHOTOCOUPLER 2CH AC INPUT 8-DIP RoHS:否 類別:隔離器 >> 光隔離器 - 晶體管，光電輸出 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 通道數(shù):2 輸入類型:DC 電壓 - 隔離:2500Vrms 電流傳輸比（最小值）:7% @ 16mA 電流傳輸比（最大）:50% @ 16mA 輸出電壓:20V 電流 - 輸出 / 通道:8mA 電流 - DC 正向(If):25mA Vce飽和（最大）:- 輸出類型:有 Vcc 的晶體管 安裝類型:通孔 封裝/外殼:8-DIP（0.400"，10.16mm） 包裝:管件 其它名稱:HCPL-2530W |
| PC825 | 功能描述:PHOTOCOUPLER 2CH DARL OUT 8-DIP RoHS:否 類別:隔離器 >> 光隔離器 - 晶體管，光電輸出 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 通道數(shù):2 輸入類型:DC 電壓 - 隔離:2500Vrms 電流傳輸比（最小值）:7% @ 16mA 電流傳輸比（最大）:50% @ 16mA 輸出電壓:20V 電流 - 輸出 / 通道:8mA 電流 - DC 正向(If):25mA Vce飽和（最大）:- 輸出類型:有 Vcc 的晶體管 安裝類型:通孔 封裝/外殼:8-DIP（0.400"，10.16mm） 包裝:管件 其它名稱:HCPL-2530W |
| PC-825 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:High Sensitivity High Density Mounting Type Photocoupler(232.40 k) |
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