參數(shù)資料
型號： PC8245MTPU300D
廠商： ATMEL CORP
元件分類： 微控制器/微處理器
英文描述： Integrated Processor Family
中文描述： 32-BIT, 300 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.27 MM PITCH, TBGA-352
文件頁數(shù)： 20/61頁
文件大小： 429K
代理商： PC8245MTPU300D
20
PC8245
2171D–HIREL–06/04
The board designer can choose between several types of thermal interface. Heat sink
adhesive materials should be selected based upon high conductivity, yet adequate
mechanical strength to meet equipment shock/vibration requirements. There are several
commercially-available thermal interfaces and adhesive materials provided by the fol-
lowing vendors:
Heat Sink Usage
An estimation of the chip junction temperature, T
J
, can be obtained from the equation:
T
J
= T
A
+ (R
θ
JA
x P
D
)
where
T
A
= ambient temperature for the package (
°
C)
R
θ
JA
= junction-to-ambient thermal resistance (
°
C/W)
P
D
= power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry-standard value that provides a
quick and easy estimation of thermal performance. Unfortunately, two values are in
common usage: the value determined on a single layer board and the value obtained on
a board with two planes. For packages such as the TBGA, these values can be different
by a factor of two. Which value is closer to the application depends on the power dissi-
pated by other components on the board. The value obtained on a single layer board is
appropriate for the tightly packed printed-circuit board. The value obtained on the board
with the internal planes is usually appropriate if the board has low power dissipation and
the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction-
to-case thermal resistance and a case-to-ambient thermal resistance:
R
θ
JA
= R
θ
JC
+ R
θ
CA
where
R
θ
JA
= junction-to-ambient thermal resistance (
°
C/W)
R
θ
JC
= junction-to-case thermal resistance (
°
C/W)
R
θ
CA
= case-to-ambient thermal resistance (
°
C/W)
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
781-935-4850
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
800-248-2481
Shin-Etsu MicroSi, Inc.
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
888-642-7674
Thermagon Inc.
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
888-246-9050
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PC8245MTPU333D 制造商:e2v Aerospace & Defense 功能描述:MPU MPC82xx RISC 32-Bit 0.25um 333MHz 3.3V 352-Pin TBGA 制造商:e2v technologies 功能描述:MPU MPC82XX RISC 32BIT 0.25UM 333MHZ 3.3V 352TBGA - Trays
PC8245MTPU350D 制造商:e2v technologies 功能描述:PC8245MTPU350D - Trays
PC824A 功能描述:PHOTOCOUPLER 2CH AC INPUT 8-DIP RoHS:否 類別:隔離器 >> 光隔離器 - 晶體管，光電輸出 系列:- 標準包裝:1,000 系列:- 通道數(shù):2 輸入類型:DC 電壓 - 隔離:2500Vrms 電流傳輸比（最小值）:7% @ 16mA 電流傳輸比（最大）:50% @ 16mA 輸出電壓:20V 電流 - 輸出 / 通道:8mA 電流 - DC 正向(If):25mA Vce飽和（最大）:- 輸出類型:有 Vcc 的晶體管 安裝類型:通孔 封裝/外殼:8-DIP（0.400"，10.16mm） 包裝:管件 其它名稱:HCPL-2530W
PC825 功能描述:PHOTOCOUPLER 2CH DARL OUT 8-DIP RoHS:否 類別:隔離器 >> 光隔離器 - 晶體管，光電輸出 系列:- 標準包裝:1,000 系列:- 通道數(shù):2 輸入類型:DC 電壓 - 隔離:2500Vrms 電流傳輸比（最小值）:7% @ 16mA 電流傳輸比（最大）:50% @ 16mA 輸出電壓:20V 電流 - 輸出 / 通道:8mA 電流 - DC 正向(If):25mA Vce飽和（最大）:- 輸出類型:有 Vcc 的晶體管 安裝類型:通孔 封裝/外殼:8-DIP（0.400"，10.16mm） 包裝:管件 其它名稱:HCPL-2530W
PC-825 制造商:未知廠家 制造商全稱:未知廠家 功能描述:High Sensitivity High Density Mounting Type Photocoupler(232.40 k)
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