參數(shù)資料
型號(hào): OR4E6
廠商: Lineage Power
英文描述: Field-Programmable Gate Arrays(現(xiàn)場(chǎng)可編程門陣列)
中文描述: 現(xiàn)場(chǎng)可編程門陣列(現(xiàn)場(chǎng)可編程門陣列)
文件頁數(shù): 78/132頁
文件大?。?/td> 2667K
代理商: OR4E6
78
Lucent Technologies Inc.
Preliminary Data Sheet
August 2000
ORCA Series 4 FPGAs
Pin Information
(continued)
Package Compatibility
Table 43 provides the number of user I/Os available for the ORCA Series 4 FPGAs for each available package.
Each package has seven dedicated configuration pins.
Table 43 provides the package pin and pin function for the ORCA Series 4 FPGAs and packages. The bond pad
name is identified in the PIO nomenclature used in the ORCA Foundry design editor.
When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the
number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).
When a package pin is to be left as a no connect for a specific die, it is indicated as a note in the device pad column
for the FPGA. The tables provide no information on unused pads.
Table 43. ORCAI/Os Summary
Device
352 PBGA
432 EBGA
680 PBGAM1
OR4E6
User I/O Single Ended
Available Differential Pairs (LVDS, LVPECL)
Configuration
Dedicated Function
V
DD
15
V
DD
33
V
DD
IO
V
SS
262
128
7
3
16
8
24
68
306
150
7
3
40
8
24
44
466
196
7
3
48
8
60
88
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