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參數(shù)資料
| 型號(hào)： | NANDBAR4N1BZBC5F |
| 廠商： | NUMONYX |
| 元件分類(lèi)： | 存儲(chǔ)器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA137 |
| 封裝： | 10.50 X 13 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-137 |
| 文件頁(yè)數(shù)： | 22/52頁(yè) |
| 文件大小： | 1126K |
| 代理商： | NANDBAR4N1BZBC5F |
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NANDxxxxNx
Signal descriptions
29/52
2.26
Ground
2.26.1
NANDxxxxNx devices delivered in TFBGA107/137/149 packages
The NAND flash memory and LPSDRAM components have separate grounds, as described
below.
NAND flash VSSF ground
VSSF is the reference for the NAND flash power supply. It must be connected to the system
ground.
LPSDRAM VSSD ground
VSSD is the reference for the NAND flash power supply. It must be connected to the system
ground.
LPSDRAM VSSQD ground
VSSQD ground is the reference for the LPSDRAM input/output circuitry driven by VDDQD.
VSSQD must be connected to VSSD.
2.26.2
NANDxxxxNx delivered in TFBGA128/152 and VFBGA160 packages
The NAND flash memory and LPSDRAM components share the same ground VSS, as
described below.
VSS ground
VSS ground is the reference for the power supply for the NAND flash and LPSDRAM
components. It must be connected to the system ground.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| NANDBAR4N2AZBA5E | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| NANDBAR4N4AZBB5E | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| NANDBAR4N5BZBC5E | 制造商:Micron Technology Inc 功能描述:WIRELESS - Trays |
| NANDBBR4E5AP4R5E | 制造商:Micron Technology Inc 功能描述:64MX16/128MX16 MCP PLASTIC PBF VFBGA 1.8V COMBO - Trays |
| NANDBBR4E5AP4R5F | 制造商:Micron Technology Inc 功能描述:128MX16/32MX32/32MX32 MCP PLASTIC PBF VFBGA 1.8V COMBO - Tape and Reel |
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