參數(shù)資料
型號： MSC8103M1200F
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號處理
英文描述： 64-BIT, 75 MHz, OTHER DSP, PBGA332
封裝： 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332
文件頁數(shù)： 42/104頁
文件大?。?/td> 1810K
代理商： MSC8103M1200F
MSC8103 Network Digital Signal Processor, Rev. 11
2-2
Freescale Semiconductor
Physical and Electrical Specifications
2.2 Recommended Operating Conditions
Table 2-2 lists recommended operating conditions. Proper device operation outside of these conditions is not
guaranteed.
Table 2-3 describes thermal characteristics of the MSC8103.
See Section 4.1, Thermal Design Considerations, on page 4-1 for details on these characteristics.
Table 2-2.
Recommended Operating Conditions
Rating
Symbol
Value
Unit
SC140 core supply voltage
VDD
275 MHz: 1.5 to 1.7
300 MHz: 1.55 to 1.7
V
PLL supply voltage
VCCSYN
275 MHz: 1.5 to 1.7
300 MHz: 1.55 to 1.7
V
I/O supply voltage
VDDH
3.135 to 3.465
V
Input voltage
VIN
–0.2 to VDDH + 0.2
V
Operating temperature range
TJ
275 MHz: –40 to 105
300 MHz: –40 to 75
°C
Table 2-3.
Thermal Characteristics
Characteristic
Symbol
Lidded FC-PBGA
17
× 17 mm
Unit
Natural Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient, single-layer board1, 2
RθJA or θJA
50
37
°C/W
Junction-to-ambient, four-layer board1, 3
RθJA or θJA
22
18
°C/W
Junction-to-board3
RθJB or θJB
15
°C/W
Junction-to-case4
RθJC or θJC
0.8
°C/W
Notes:
1.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Per SEMI G38-87 and EIA/JESD51-2 with the single layer board horizontal.
3.
Per JEDEC JESD51-6 with the board (JESD51-9) horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
5.
Thermal resistance between the die and the case top surface without thermal grease. TBD = to be determined. If a thin (less
than 50 micron) thermal grease interface is established to a heat sink from the lid, the junction to sink thermal resistance is
about 0.7 °C/W.
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