參數(shù)資料
型號(hào)： MSC8103M1200F
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 數(shù)字信號(hào)處理
英文描述： 64-BIT, 75 MHz, OTHER DSP, PBGA332
封裝： 17 X 17 MM, FLIP-CHIP, PLASTIC, BGA-332
文件頁(yè)數(shù)： 104/104頁(yè)
文件大?。?/td> 1810K
代理商： MSC8103M1200F
MSC8103 Network Digital Signal Processor, Rev. 11
Freescale Semiconductor
4-1
Design Considerations
4
This chapter includes design and layout guidelines for manufacturing boards using the MSC8103.
4.1 Thermal Design Considerations
The average chip-junction temperature, TJ, in ° C can be obtained from the following:
TJ = TA + (PD θJA)
Equation 1
where
TA = ambient temperature ° C
θ
JA = package thermal resistance, junction to ambient, ° C/W
PD = PINT + PI/O in W
PINT = IDD × VDD in W—chip internal power
PI/O = power dissipation on output pins in W—user determined
The user should set TA and PD such that TJ does not exceed the maximum operating conditions. In case TJ is too
high, the user should either lower the ambient temperature or the power dissipation of the chip.
The input voltage must not exceed the I/O supply VDDH by more than 2.5 V at any time, including during power-on
reset. In turn, VDDH can exceed VDD/VCCSYN by more than 3.3 V during power-on reset, but for no more than 100 ms.
VDDH should not exceed VDD/VCCSYN by more than 2.1 V during normal operation. VDD/VCCSYN must not exceed VDDH
by more than 0.4 V at any time, including during power-on reset. Therefore the recommendation is to use
“bootstrap” diodes between the power rails, as shown in Figure 4-1.
Figure 4-1.
Bootstrap Diodes for Power-Up Sequencing
I/O Power
Core/PLL
Supply
MUR420
3.3 V (VDDH)
1.6 V (VDD/VCCSYN)
相關(guān)PDF資料
PDF描述
MSC8144EC 0-BIT, 133 MHz, OTHER DSP, PBGA783
MSC8144E 0-BIT, 150 MHz, OTHER DSP, PBGA783
MSC8152TVT1000B RISC PROCESSOR, PBGA783
MSC8154ETVT1000B 0-BIT, OTHER DSP, PBGA783
MSC8252TVT1000B 0-BIT, OTHER DSP, PBGA783
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSC8103RM/D 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Network Digital Signal Processor
MSC8103VT1100F 功能描述:IC DSP 16BIT 275MHZ 332-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:StarCore 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤(pán)
MSC8103VT1200F 功能描述:IC DSP 16BIT 300MHZ 332-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數(shù)字式信號(hào)處理器） 系列:StarCore 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI，以太網(wǎng)，RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA（20x20） 包裝:托盤(pán)
MSC81058 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:RF & MICROWAVE TRANSISTORS GENERAL PURPOSE AMPLIFIER APPLICATIONS
MSC81090 制造商:ASI 制造商全稱:ASI 功能描述:NPN SILICON RF POWER TRANSISTOR
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*