- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄45375 > MPE603ERX100LX (MOTOROLA INC) 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 PDF資料下載
參數(shù)資料
| 型號： | MPE603ERX100LX |
| 廠商： | MOTOROLA INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | CERAMIC, BGA-255 |
| 文件頁數(shù)： | 28/32頁 |
| 文件大?。?/td> | 135K |
| 代理商： | MPE603ERX100LX |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁當(dāng)前第28頁第29頁第30頁第31頁第32頁
EC603e Microprocessor Hardware Specifications (PID6)
5
Table 2 provides the recommended operating conditions for the PID6.
Table 3 provides the packages thermal characteristics for the PID6.
Table 4 provides the DC electrical characteristics for the PID6.
Table 2. Recommended Operating Conditions
Characteristic
Symbol
Value
Unit
Core supply voltage
Vdd
3.3 ± 165mv
V
PLL supply voltage
AVdd
3.3 ± 165mv
V
I/O supply voltage
OVdd
3.3 ± 165mv
V
Input voltage
Vin
–0.3 to 5.5
V
Die-junction temperature
Tj
0 to 105
°C
Note:
1. These are the recommended and tested operating conditions. Proper device operation
outside of these conditions is not guaranteed.
Table 3. Package Thermal Characteristics
Characteristic
Symbol
Value
Rating
Wire-bond CQFP package die junction-to-case thermal resistance (typical)
θ
JC
2.2
°C/W
Wire-bond CQFP package die junction-to-lead thermal resistance (typical)
θ
JB
18.0
°C/W
CBGA package die junction-to-case thermal resistance (typical)
θ
JC
0.08
°C/W
CBGA package die junction-to-ball thermal resistance (typical)
θ
JB
2.8
°C/W
Note: Refer to Section 1.8, “System Design Information,” for more details about thermal management.
Table 4. DC Electrical Specifications
At recommended operating conditions. See Table 2
Characteristic
Symbol
Min
Max
Unit
Notes
Input high voltage (all inputs except SYSCLK)
VIH
2.0
5.5
V
Input low voltage (all inputs except SYSCLK)
VIL
-0.3
0.8
V
SYSCLK input high voltage
CVIH
2.4
5.5
V
SYSCLK input low voltage
CVIL
-0.3
0.4
V
Input leakage current, Vin = 3.465 V
Vin = 5.5 V
Iin
—10
A
1
Iin
—
245
A
1
Hi-Z (off-state) leakage current, Vin = 3.465 V
Vin = 5.5 V
ITSI
—10
A
1
ITSI
—
245
A
1
Output high voltage, IOH = –9 mA
VOH
2.4
—
V
1
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPE603PFE200LX | 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 |
| MPE603PRX200LX | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255 |
| MPE603PFE166LX | 32-BIT, 167 MHz, RISC PROCESSOR, CQFP240 |
| MPE603RRX300LX | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 |
| MPM21CUA650B | 32-BIT, 650 MHz, MICROPROCESSOR, XMA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPE603ERX133LN | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PowerPC 603e RISC Microprocessor Family: PID6-603e (Stretch) Part Number Specifications |
| MPE603RRX200LC | 制造商:Freescale Semiconductor 功能描述: |
| MPE603RRX266LC | 制造商:Motorola Inc 功能描述: |
| MPE-60S | 制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Single Output, 60W Compact, Enclosed AC/DC Power Supplies |
| MPE-60S-05 | 制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Single Output, 60W Compact, Enclosed AC/DC Power Supplies |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。